THERMALLY STABLE SOLDER PASTE NO
| Part | Melting Point [Min] [custom] | Melting Point [Max] [custom] | Melting Point [Min] [custom] | Melting Point [Max] [custom] | Flux Type | Shelf Life Start | Mesh Type [custom] | Form | Form | Form | Form | Storage/Refrigeration Temperature [Max] | Storage/Refrigeration Temperature [Min] | Shelf Life | Composition | Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Chip Quik Inc. TS391SNL10 | 423 °F | 220 °C | 217 °C | 428 °F | No-Clean | Date of Manufacture | 4 | 35 g | 1.23 oz | 10 cc | Syringe | 77 °F | 68 °F | 12 Months | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Solder Paste |