TS391SNL10
ActiveChip Quik Inc.
THERMALLY STABLE SOLDER PASTE NO
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TS391SNL10
ActiveChip Quik Inc.
THERMALLY STABLE SOLDER PASTE NO
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | TS391SNL10 |
|---|---|
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Flux Type | No-Clean |
| Form | 35 g |
| Form | 1.23 oz |
| Form | 10 cc |
| Form | Syringe |
| Melting Point [Max] [custom] | 220 °C |
| Melting Point [Max] [custom] | 428 °F |
| Melting Point [Min] [custom] | 423 °F |
| Melting Point [Min] [custom] | 217 °C |
| Mesh Type [custom] | 4 |
| Shelf Life | 12 Months |
| Shelf Life Start | Date of Manufacture |
| Storage/Refrigeration Temperature [Max] | 77 °F |
| Storage/Refrigeration Temperature [Min] | 68 °F |
| Type | Solder Paste |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 1 | $ 31.95 | |
Description
General part information
TS391SNL10
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 1.23 oz (35g), 10cc
Documents
Technical documentation and resources