CONN RCPT 80POS 0.05 GOLD SMD
| Part | Contact Material | Mounting Type | Number of Positions Loaded | Insulation Color | Pitch - Mating | Pitch - Mating | Fastening Type | Contact Finish - Post | Row Spacing - Mating | Row Spacing - Mating | Current Rating (Amps) | Insulation Material | Material Flammability Rating | Operating Temperature [Min] | Operating Temperature [Max] | Contact Shape | Contact Type | Insulation Height | Insulation Height | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Number of Positions | Connector Type | Contact Finish - Mating | Termination | Contact Length - Post [x] | Contact Length - Post | Features | Contact Length - Post [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Beryllium Copper | Surface Mount | All | Black | 0.05 in | 1.27 mm | Push-Pull | Tin | 0.05 in | 1.27 mm | 2.6 A | Liquid Crystal Polymer (LCP) | UL94 V-0 | -55 °C | 125 °C | Square | Female Socket | 4.51 mm | 0.178 in | 30 Áin | 0.76 Ám | 80 | Receptacle | Gold | Solder | ||||
Samtec Inc. | Beryllium Copper | Through Hole | All | Black | 0.05 in | 1.27 mm | Push-Pull | Tin | 0.05 in | 1.27 mm | 2.6 A | Liquid Crystal Polymer (LCP) | UL94 V-0 | -55 °C | 125 °C | Square | Female Socket | 4.57 mm | 0.18 " | 10 çin | 0.25 çm | 80 | Receptacle | Gold | Solder | 0.075 in | 1.91 mm | ||
Samtec Inc. | Beryllium Copper | Surface Mount | All | Black | 0.05 in | 1.27 mm | Push-Pull | Tin | 0.05 in | 1.27 mm | 2.6 A | Liquid Crystal Polymer (LCP) | UL94 V-0 | -55 °C | 125 °C | Square | Female Socket | 4.51 mm | 0.178 in | 30 Áin | 0.76 Ám | 80 | Receptacle | Gold | Solder | Pick and Place | |||
Samtec Inc. | Beryllium Copper | Through Hole | All | Black | 0.05 in | 1.27 mm | Push-Pull | Tin | 0.05 in | 1.27 mm | 2.6 A | Liquid Crystal Polymer (LCP) | UL94 V-0 | -55 °C | 125 °C | Square | Female Socket | 4.57 mm | 0.18 " | 30 Áin | 0.76 Ám | 80 | Receptacle | Gold | Solder | 0.075 in | 1.91 mm | ||
Samtec Inc. | Beryllium Copper | Surface Mount | All | Black | 0.05 in | 1.27 mm | Push-Pull | Tin | 0.05 in | 1.27 mm | 2.6 A | Liquid Crystal Polymer (LCP) | UL94 V-0 | -55 °C | 125 °C | Square | Female Socket | 4.51 mm | 0.178 in | 30 Áin | 0.76 Ám | 80 | Receptacle | Gold | Solder | ||||
Samtec Inc. | Beryllium Copper | Through Hole | All | Black | 0.05 in | 1.27 mm | Push-Pull | Tin | 0.05 in | 1.27 mm | 2.6 A | Liquid Crystal Polymer (LCP) | UL94 V-0 | -55 °C | 125 °C | Square | Female Socket | 4.57 mm | 0.18 " | 30 Áin | 0.76 Ám | 80 | Receptacle | Gold | Solder | 0.12 in | 3.05 mm | ||
Samtec Inc. | Beryllium Copper | Through Hole | All | Black | 0.05 in | 1.27 mm | Push-Pull | Tin | 0.05 in | 1.27 mm | 2.6 A | Liquid Crystal Polymer (LCP) | UL94 V-0 | -55 °C | 125 °C | Square | Female Socket | 4.57 mm | 0.18 " | 10 çin | 0.25 çm | 80 | Receptacle | Gold | Solder | 0.075 in | 1.91 mm | ||
Samtec Inc. | Beryllium Copper | Surface Mount | All | Black | 0.05 in | 1.27 mm | Push-Pull | Tin | 0.05 in | 1.27 mm | 2.6 A | Liquid Crystal Polymer (LCP) | UL94 V-0 | -55 °C | 125 °C | Square | Female Socket | 4.51 mm | 0.178 in | 30 Áin | 0.76 Ám | 80 | Receptacle | Gold | Solder | Board Lock Pick and Place | |||
Samtec Inc. | Beryllium Copper | Surface Mount | All | Black | 0.05 in | 1.27 mm | Push-Pull | Tin | 0.05 in | 1.27 mm | 2.6 A | Liquid Crystal Polymer (LCP) | UL94 V-0 | -55 °C | 125 °C | Square | Female Socket | 4.51 mm | 0.178 in | 30 Áin | 0.76 Ám | 80 | Receptacle | Gold | Solder | Board Lock Pick and Place | |||
Samtec Inc. | Beryllium Copper | Surface Mount | All | Black | 0.05 in | 1.27 mm | Push-Pull | Tin | 0.05 in | 1.27 mm | 2.6 A | Liquid Crystal Polymer (LCP) | UL94 V-0 | -55 °C | 125 °C | Square | Female Socket | 4.51 mm | 0.178 in | 30 Áin | 0.76 Ám | 80 | Receptacle | Gold | Solder |