Beta
⌘K
CONN IC DIP SOCKET 12POS GOLD
| Part | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Pitch - Mating | Pitch - Mating | Type | Type | Type | Contact Finish - Post | Current Rating (Amps) | Termination | Number of Positions or Pins (Grid) | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Housing Material | Contact Material - Post [custom] | Contact Finish - Mating | Termination Post Length | Termination Post Length | Operating Temperature [Max] | Operating Temperature [Min] | Pitch - Post | Pitch - Post | Material Flammability Rating | Contact Material - Mating | Features |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 200 µin | 5.08 µm | 0.1 in | 2.54 mm | 0.3 " | 7.62 mm | DIP | Tin | 3 A | Solder | 2 6 12 | 30 Áin | 0.76 Ám | Glass Filled Nylon 4/6 Polyamide (PA46) | Brass | Gold | 3.56 mm | 0.14 in | 105 ░C | -55 °C | 2.54 mm | 0.1 in | UL94 V-0 | Beryllium Copper | Closed Frame |