TS3USB30 Series
High-Speed USB 2.0 1:2 Mux/Demux Switch With Single Enable and ESD Protection
Manufacturer: Texas Instruments
Catalog(3 parts)
| Part | Mounting Type | Operating Temperature▲▼ | Operating Temperature▲▼ | Applications | Supplier Device Package | Voltage - Supply, Single (V+)▲▼ | Voltage - Supply, Single (V+)▲▼ | Features | -3db Bandwidth▲▼ | Number of Channels▲▼ | Switch Circuit | On-State Resistance (Max)▲▼ | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Surface Mount | 85 °C | -40 °C | USB | 10-UQFN (1.8x1.4) | 4.300000190734863 V | 3 V | Bi-Directional, USB 2.0 | 900000000 Hz | 1 ul | DPDT | 10 Ω | 10-UFQFN | |
Surface Mount | 85 °C | -40 °C | USB | 10-VSSOP | 4.300000190734863 V | 3 V | Bi-Directional, USB 2.0 | 900000000 Hz | 1 ul | DPDT | 10 Ω | 10-MSOP, 10-TFSOP | |
Surface Mount | 85 °C | -40 °C | USB | 10-UQFN (1.8x1.4) | 4.300000190734863 V | 3 V | Bi-Directional, USB 2.0 | 955000000 Hz | 1 ul | DPDT | 10 Ω | 10-UFQFN |
Key Features
• VCC operation at 2.7V to 4.3VD+/D– pins tolerate up to 5.25V1.8V compatible control-pin inputsIOFF supports partial power-down-mode operationRON = 10Ω maximumΔRON = 0.35Ω typicalCio(ON) = 7.5pF typicalLow power consumption (70nA maximum)–3dB bandwidth = 1400MHz typicalLatch-up performance exceeds 100mA per JESD 78, Class II(1)ESD performance tested per JESD 228000V human-body model (A114-B, Class II)1000V charged-device model (C101)ESD performance I/O port to GND(2)15000V human-body modelPackaged in 10-pin UQFN (1.8mm × 1.4mm)(1)Except OE and S inputs(2)High-voltage HBM is performed in addition to the standard HBM testing (A114-B, Class II) and applies to I/O ports tested with respect to GND only.VCC operation at 2.7V to 4.3VD+/D– pins tolerate up to 5.25V1.8V compatible control-pin inputsIOFF supports partial power-down-mode operationRON = 10Ω maximumΔRON = 0.35Ω typicalCio(ON) = 7.5pF typicalLow power consumption (70nA maximum)–3dB bandwidth = 1400MHz typicalLatch-up performance exceeds 100mA per JESD 78, Class II(1)ESD performance tested per JESD 228000V human-body model (A114-B, Class II)1000V charged-device model (C101)ESD performance I/O port to GND(2)15000V human-body modelPackaged in 10-pin UQFN (1.8mm × 1.4mm)(1)Except OE and S inputs(2)High-voltage HBM is performed in addition to the standard HBM testing (A114-B, Class II) and applies to I/O ports tested with respect to GND only.
Description
AI
The TS3USB30E is a high-bandwidth 1:2 switch specially designed for the switching of high-speed USB 2.0 signals in handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers with limited USB I/Os. The wide bandwidth (1400MHz) of this switch allows signals to pass with minimum edge and phase distortion. The device multiplexes differential outputs from a USB host device to one of two corresponding outputs, or from two different hosts to one corresponding output. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. The TS3USB30E is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480Mbps).
The TS3USB30E integrates ESD protection cells on all pins, is available in a tiny UQFN package (1.8mm × 1.4mm) or a VSSOP package, and is characterized over the free-air temperature range of –40°C to 85°C.
The TS3USB30E is a high-bandwidth 1:2 switch specially designed for the switching of high-speed USB 2.0 signals in handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers with limited USB I/Os. The wide bandwidth (1400MHz) of this switch allows signals to pass with minimum edge and phase distortion. The device multiplexes differential outputs from a USB host device to one of two corresponding outputs, or from two different hosts to one corresponding output. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. The TS3USB30E is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480Mbps).
The TS3USB30E integrates ESD protection cells on all pins, is available in a tiny UQFN package (1.8mm × 1.4mm) or a VSSOP package, and is characterized over the free-air temperature range of –40°C to 85°C.