HEATSINK CPU W/ADHESIVE 1.11"SQ
| Part | Package Cooled | Type | Thermal Resistance @ Forced Air Flow | Attachment Method | Material | Shelf Life | Shape | Fin Height | Fin Height | Length [x] | Length [x] | Material Finish | Width [x] | Width [x] | Thermal Resistance @ Natural | 
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Tusonix a Subsidiary of CTS Electronic Components  | ASIC  BGA  CPU  LGA  | Top Mount  | 7.2 °C/W  400 LFM  | Thermal Tape  Adhesive (Included)  | Aluminum  | 24 Months  | Pin Fins  Square  | 9.02 mm  | 0.355 in  | 1.11 in  | 28.19 mm  | Black Anodized  | 1.11 in  | 28.19 mm  | 20.9 °C/W  |