BDN11-3CB/A01

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Tusonix a Subsidiary of CTS Electronic Components

HEATSINK CPU W/ADHESIVE 1.11"SQ

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Tusonix a Subsidiary of CTS Electronic Components

HEATSINK CPU W/ADHESIVE 1.11"SQ

Technical Specifications

Parameters and characteristics for this part

Specification	BDN11-3CB/A01

Attachment Method	Thermal Tape, Adhesive (Included)
Fin Height	9.02 mm
Fin Height	0.355 in
Length [x]	1.11 in
Length [x]	28.19 mm
Material	Aluminum
Material Finish	Black Anodized
Package Cooled	ASIC, BGA, LGA, CPU
Shape	Square, Pin Fins
Shelf Life	24 Months
Thermal Resistance @ Forced Air Flow	400 LFM, 7.2 °C/W
Thermal Resistance @ Natural	20.9 °C/W
Type	Top Mount
Width [x]	1.11 in
Width [x]	28.19 mm

Part	Package Cooled	Type	Thermal Resistance @ Forced Air Flow	Attachment Method	Material	Shelf Life	Shape	Fin Height	Fin Height	Length [x]	Length [x]	Material Finish	Width [x]	Width [x]	Thermal Resistance @ Natural
Tusonix a Subsidiary of CTS Electronic Components BDN11-3CB/A01	ASIC BGA CPU LGA	Top Mount	7.2 °C/W 400 LFM	Thermal Tape Adhesive (Included)	Aluminum	24 Months	Pin Fins Square	9.02 mm	0.355 in	1.11 in	28.19 mm	Black Anodized	1.11 in	28.19 mm	20.9 °C/W

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount

Technical documentation and resources