CONN RCPT 20P 0.079 GOLD PCB R/A
| Part | Mounting Type | Contact Length - Post | Contact Length - Post | Number of Positions Loaded | Number of Positions | Style | Row Spacing - Mating | Row Spacing - Mating | Number of Rows | Insulation Color | Fastening Type | Connector Type | Material Flammability Rating | Contact Material | Pitch - Mating [x] | Pitch - Mating [x] | Contact Finish - Post | Contact Type | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Current Rating (Amps) | Insulation Height [custom] | Insulation Height [custom] | Insulation Material | Termination | Operating Temperature [Min] | Operating Temperature [Max] | Contact Shape | Insulation Height | Insulation Height | Number of Positions Loaded | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Through Hole Right Angle | 0.09 " | 2.29 mm | All | 20 | Board to Board Cable | 0.079 in | 2 mm | 2 | Black | Push-Pull | Receptacle | UL94 V-0 | Phosphor Bronze | 0.079 in | 2 mm | Tin | Forked | Gold | 10 çin | 0.25 çm | 5.1 A | 0.157 in | 4 mm | Liquid Crystal Polymer (LCP) | Solder | -55 °C | 125 °C | Square | ||||||
Samtec Inc. | Through Hole | 0.09 " | 2.29 mm | All | 10 | Board to Board Cable | 1 | Black | Push-Pull | Receptacle | UL94 V-0 | Phosphor Bronze | 0.079 in | 2 mm | Tin | Forked | Gold | 30 Áin | 0.76 Ám | 5.1 A | Liquid Crystal Polymer (LCP) | Solder | -55 °C | 125 °C | Square | 6.35 mm | 0.25 in | ||||||||
Samtec Inc. | Through Hole | 0.09 " | 2.29 mm | 10 | Board to Board Cable | 1 | Black | Push-Pull | Receptacle | UL94 V-0 | Phosphor Bronze | 0.079 in | 2 mm | Tin | Forked | Gold | 10 çin | 0.25 çm | 5.1 A | Liquid Crystal Polymer (LCP) | Solder | -55 °C | 125 °C | Square | 6.35 mm | 0.25 in | 9 | ||||||||
Samtec Inc. | Through Hole | 0.09 " | 2.29 mm | All | 20 | Board to Board Cable | 0.079 in | 2 mm | 2 | Black | Push-Pull | Receptacle | UL94 V-0 | Phosphor Bronze | 0.079 in | 2 mm | Tin | Forked | Gold | 10 çin | 0.25 çm | 5.1 A | Liquid Crystal Polymer (LCP) | Solder | -55 °C | 125 °C | Square | 6.35 mm | 0.25 in | ||||||
Samtec Inc. | Through Hole | 0.09 " | 2.29 mm | 20 | Board to Board Cable | 0.079 in | 2 mm | 2 | Black | Push-Pull | Receptacle | UL94 V-0 | Phosphor Bronze | 0.079 in | 2 mm | Tin | Forked | Gold | 5.1 A | Liquid Crystal Polymer (LCP) | Solder | -55 °C | 125 °C | Square | 6.35 mm | 0.25 in | 19 | Flash | |||||||
Samtec Inc. | Through Hole | 0.09 " | 2.29 mm | 20 | Board to Board Cable | 0.079 in | 2 mm | 2 | Black | Push-Pull | Receptacle | UL94 V-0 | Phosphor Bronze | 0.079 in | 2 mm | Tin | Forked | Gold | 10 çin | 0.25 çm | 5.1 A | Liquid Crystal Polymer (LCP) | Solder | -55 °C | 125 °C | Square | 6.35 mm | 0.25 in | 19 | ||||||
Samtec Inc. | Through Hole | 0.09 " | 2.29 mm | All | 40 | Board to Board Cable | 0.079 in | 2 mm | Black | Push-Pull | Receptacle | UL94 V-0 | Phosphor Bronze | 0.079 in | 2 mm | Tin | Forked | Gold | 30 Áin | 0.76 Ám | 5.1 A | Liquid Crystal Polymer (LCP) | Solder | -55 °C | 125 °C | Square | 6.35 mm | 0.25 in | |||||||
Samtec Inc. | Through Hole | 0.09 " | 2.29 mm | 20 | Board to Board Cable | 0.079 in | 2 mm | 2 | Black | Push-Pull | Receptacle | UL94 V-0 | Phosphor Bronze | 0.079 in | 2 mm | Tin | Forked | Gold | 5.1 A | Liquid Crystal Polymer (LCP) | Solder | -55 °C | 125 °C | Square | 6.35 mm | 0.25 in | 19 | Flash | |||||||
Samtec Inc. | Through Hole | 0.09 " | 2.29 mm | All | 40 | Board to Board Cable | 0.079 in | 2 mm | Black | Push-Pull | Receptacle | UL94 V-0 | Phosphor Bronze | 0.079 in | 2 mm | Tin | Forked | Gold | 10 çin | 0.25 çm | 5.1 A | Liquid Crystal Polymer (LCP) | Solder | -55 °C | 125 °C | Square | 6.35 mm | 0.25 in | |||||||
Samtec Inc. | Through Hole Right Angle | 0.09 " | 2.29 mm | All | 10 | Board to Board Cable | 1 | Black | Push-Pull | Receptacle | UL94 V-0 | Phosphor Bronze | 0.079 in | 2 mm | Gold | Forked | Gold | 20 µin | 0.51 µm | 5.1 A | Liquid Crystal Polymer (LCP) | Solder | -55 °C | 125 °C | Square | 2 mm | 0.079 in | 3 µin | 0.076 µm |