SQT-110 Series
Manufacturer: Samtec Inc.
CONN RCPT 10POS 0.079 GOLD PCB
| Part | Contact Finish - Mating | Contact Type | Fastening Type | Contact Length - Post | Contact Finish Thickness - Mating | Mounting Type | Number of Positions Loaded | Contact Finish - Post | Connector Type | Material Flammability Rating | Style | Number of Rows | Number of Positions | Termination | Pitch - Mating | Operating Temperature (Max) | Operating Temperature (Min) | Insulation Height | Insulation Color | Current Rating (Per Contact) | Insulation Material | Contact Shape | Contact Material | Number of Positions Loaded | Row Spacing - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Gold | Forked | Push-Pull | 0.09 in | 10 µin | Through Hole | 9 | Tin | Receptacle | UL94 V-0 | Board Board or Cable | 1 | 10 | Solder | 0.079 in | 125 °C | -55 °C | 0.25 in | Black | 5.1 A | Liquid Crystal Polymer (LCP) | Square | Phosphor Bronze | ||||
Samtec Inc. | Gold | Forked | Push-Pull | 0.09 in | 10 µin | Right Angle Through Hole | Tin | Receptacle | UL94 V-0 | Board Board or Cable | 2 | 20 | Solder | 0.079 in | 125 °C | -55 °C | 0.157 in | Black | 5.1 A | Liquid Crystal Polymer (LCP) | Square | Phosphor Bronze | All | 0.079 in | |||
Samtec Inc. | Gold | Forked | Push-Pull | 0.09 in | 30 µin | Through Hole | Tin | Receptacle | UL94 V-0 | Board Board or Cable | 1 | 10 | Solder | 0.079 in | 125 °C | -55 °C | 0.25 in | Black | 5.1 A | Liquid Crystal Polymer (LCP) | Square | Phosphor Bronze | All | ||||
Samtec Inc. | Gold | Forked | Push-Pull | 0.6 in | Through Hole | Tin | Receptacle | UL94 V-0 | Board Board or Cable | 2 | 20 | Solder | 0.079 in | 125 °C | -55 °C | 0.25 in | Black | 5.1 A | Liquid Crystal Polymer (LCP) | Square | Phosphor Bronze | All | 0.079 in | Flash | |||
Samtec Inc. | Gold | Forked | Push-Pull | 0.09 in | 10 µin | Through Hole | 9 | Tin | Receptacle | UL94 V-0 | Board Board or Cable | 1 | 10 | Solder | 0.079 in | 125 °C | -55 °C | 0.25 in | Black | 5.1 A | Liquid Crystal Polymer (LCP) | Square | Phosphor Bronze | ||||
Samtec Inc. | Gold | Forked | Push-Pull | 0.09 in | 10 µin | Through Hole | Tin | Receptacle | UL94 V-0 | Board Board or Cable | 2 | 20 | Solder | 0.079 in | 125 °C | -55 °C | 0.25 in | Black | 5.1 A | Liquid Crystal Polymer (LCP) | Square | Phosphor Bronze | All | 0.079 in | |||
Samtec Inc. | Gold | Forked | Push-Pull | 0.09 in | Through Hole | 19 | Tin | Receptacle | UL94 V-0 | Board Board or Cable | 2 | 20 | Solder | 0.079 in | 125 °C | -55 °C | 0.25 in | Black | 5.1 A | Liquid Crystal Polymer (LCP) | Square | Phosphor Bronze | 0.079 in | Flash | |||
Samtec Inc. | Gold | Forked | Push-Pull | 0.09 in | 50 µin | Through Hole | Gold | Receptacle | UL94 V-0 | Board Board or Cable | 4 | 40 | Solder | 0.079 in | 125 °C | -55 °C | 0.25 in | Black | 5.1 A | Liquid Crystal Polymer (LCP) | Square | Phosphor Bronze | All | 0.079 in | 3 µin | ||
Samtec Inc. | Gold | Forked | Push-Pull | 0.09 in | 10 µin | Through Hole | 19 | Tin | Receptacle | UL94 V-0 | Board Board or Cable | 2 | 20 | Solder | 0.079 in | 125 °C | -55 °C | 0.25 in | Black | 5.1 A | Liquid Crystal Polymer (LCP) | Square | Phosphor Bronze | 0.079 in | |||
Samtec Inc. | Gold | Forked | Push-Pull | 0.09 in | 30 µin | Through Hole | Tin | Receptacle | UL94 V-0 | Board Board or Cable | 4 | 40 | Solder | 0.079 in | 125 °C | -55 °C | 0.25 in | Black | 5.1 A | Liquid Crystal Polymer (LCP) | Square | Phosphor Bronze | All | 0.079 in |