FTM-112 Series
Manufacturer: Samtec Inc.
CONN HEADER SMD 24POS 1MM
| Part | Insulation Material | Contact Length - Mating | Current Rating (Per Contact) | Row Spacing - Mating | Shrouding | Contact Shape | Contact Material | Contact Finish - Mating | Termination | Operating Temperature (Max) | Operating Temperature (Min) | Contact Type | Pitch - Mating | Style | Insulation Color | Contact Finish - Post | Number of Positions Loaded | Features | Number of Rows | Insulation Height | Fastening Type | Mounting Type | Connector Type | Number of Positions | Contact Finish Thickness - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Liquid Crystal Polymer (LCP) | 0.065 in | 2.8 A | 0.039 in | Unshrouded | Square | Phosphor Bronze | Gold | Solder | 125 °C | -55 °C | Male Pin | 0.039 in | Board | Black | Tin | All | Board Guide End Shrouds | 2 | 0.038 in | Push-Pull | Surface Mount | Cuttable Header | 24 pos | 10 µin |
Samtec Inc. | Liquid Crystal Polymer (LCP) | 0.065 in | 2.8 A | 0.039 in | Unshrouded | Square | Phosphor Bronze | Gold | Solder | 125 °C | -55 °C | Male Pin | 0.039 in | Board | Black | Tin | All | End Shrouds Pick and Place | 2 | 0.038 in | Push-Pull | Surface Mount | Cuttable Header | 24 pos | 10 µin |
Samtec Inc. | Liquid Crystal Polymer (LCP) | 0.065 in | 2.8 A | 0.039 in | Unshrouded | Square | Phosphor Bronze | Gold | Solder | 125 °C | -55 °C | Male Pin | 0.039 in | Board | Black | Tin | All | End Shrouds | 2 | 0.038 in | Push-Pull | Surface Mount | Cuttable Header | 24 pos | 3 µin |
Samtec Inc. | Liquid Crystal Polymer (LCP) | 0.065 in | 2.8 A | 0.039 in | Unshrouded | Square | Phosphor Bronze | Gold | Solder | 125 °C | -55 °C | Male Pin | 0.039 in | Board | Black | Tin | All | End Shrouds | 2 | 0.038 in | Push-Pull | Surface Mount | Cuttable Header | 24 pos | 10 µin |
Samtec Inc. | Liquid Crystal Polymer (LCP) | 0.075 in | 2.8 A | 0.039 in | Unshrouded | Square | Phosphor Bronze | Gold | Solder | 125 °C | -55 °C | Male Pin | 0.039 in | Board | Black | Tin | All | End Shrouds Pick and Place | 2 | 0.038 in | Push-Pull | Surface Mount | Cuttable Header | 24 pos | 10 µin |
Samtec Inc. | Liquid Crystal Polymer (LCP) | 0.065 in | 2.8 A | 0.039 in | Unshrouded | Square | Phosphor Bronze | Gold | Solder | 125 °C | -55 °C | Male Pin | 0.039 in | Board | Black | Tin | All | 2 | 0.038 in | Push-Pull | Surface Mount | Cuttable Header | 24 pos | 10 µin | |
Samtec Inc. | Liquid Crystal Polymer (LCP) | 0.075 in | 2.8 A | 0.039 in | Unshrouded | Square | Phosphor Bronze | Gold | Solder | 125 °C | -55 °C | Male Pin | 0.039 in | Board | Black | Tin | All | 2 | 0.038 in | Push-Pull | Surface Mount | Cuttable Header | 24 pos | 10 µin | |
Samtec Inc. | Liquid Crystal Polymer (LCP) | 0.075 in | 2.8 A | 0.039 in | Unshrouded | Square | Phosphor Bronze | Gold | Solder | 125 °C | -55 °C | Male Pin | 0.039 in | Board | Black | All | 2 | 0.038 in | Push-Pull | Surface Mount | Cuttable Header | 24 pos | |||
Samtec Inc. | Liquid Crystal Polymer (LCP) | 0.065 in | 2.8 A | 0.039 in | Unshrouded | Square | Phosphor Bronze | Gold | Solder | 125 °C | -55 °C | Male Pin | 0.039 in | Board | Black | All | 2 | 0.038 in | Push-Pull | Surface Mount | Cuttable Header | 24 pos | |||
Samtec Inc. | Liquid Crystal Polymer (LCP) | 0.075 in | 2.8 A | 0.039 in | Unshrouded | Square | Phosphor Bronze | Gold | Solder | 125 °C | -55 °C | Male Pin | 0.039 in | Board | Black | Tin | All | Board Guide End Shrouds | 2 | 0.038 in | Push-Pull | Surface Mount | Cuttable Header | 24 pos | 10 µin |