Catalog(3 parts)
| Part | Mounting Type | Number of Elements▲▼ | Current - Output High, Low▲▼ | Current - Output High, Low▲▼ | Number of Bits per Element▲▼ | Logic Type | Voltage - Supply▲▼ | Voltage - Supply▲▼ | Package / Case | Output Type | Operating Temperature▲▼ | Operating Temperature▲▼ | Package / Case▲▼ | Package / Case▲▼ | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments SN74AHC16540DGVRBuffer, Inverting 2 Element 8 Bit per Element 3-State Output 48-TVSOP | Surface Mount | 2 ul | 0.00800000037997961 A | 0.00800000037997961 A | 8 ul | Buffer, Inverting | 2 V | 5.5 V | 48-TFSOP | 3-State | 85 °C | -40 °C | |||
Texas Instruments SN74AHC16540DGGRBuffer, Inverting 2 Element 8 Bit per Element 3-State Output 48-TSSOP | Surface Mount | 2 ul | 0.00800000037997961 A | 0.00800000037997961 A | 8 ul | Buffer, Inverting | 2 V | 5.5 V | 48-TFSOP | 3-State | 85 °C | -40 °C | 0.006099999882280827 m | 0.006095999851822853 m | 48-TSSOP |
Surface Mount | 2 ul | 0.00800000037997961 A | 0.00800000037997961 A | 8 ul | Buffer, Inverting | 2 V | 5.5 V | 48-BSSOP (0.295", 7.50mm Width) | 3-State | 85 °C | -40 °C | 48-SSOP |
Key Features
• Members of the Texas InstrumentsWidebusTMFamilyEPICTM(Enhanced-Performance Implanted CMOS) ProcessOperating Range 2-V to 5.5-V VCCDistributed VCCand GND Pins Minimize High-Speed Switching NoiseFlow-Through Architecture Optimizes PCB LayoutLatch-Up Performance Exceeds 250 mA Per JESD 17ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), and Thin Very Small-Outline (DGV) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center SpacingsEPIC and Widebus are trademarks of Texas Instruments Incorporated.Members of the Texas InstrumentsWidebusTMFamilyEPICTM(Enhanced-Performance Implanted CMOS) ProcessOperating Range 2-V to 5.5-V VCCDistributed VCCand GND Pins Minimize High-Speed Switching NoiseFlow-Through Architecture Optimizes PCB LayoutLatch-Up Performance Exceeds 250 mA Per JESD 17ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), and Thin Very Small-Outline (DGV) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center SpacingsEPIC and Widebus are trademarks of Texas Instruments Incorporated.
Description
AI
These 16-bit buffers and bus drivers provide a high-performance bus interface for wide data paths.
The 3-state control gate is a 2-input AND gate with active-low inputs so that if either output-enable (OE1\ or OE2\) input is high, all corresponding outputs are in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE\ should be tied to VCCthrough a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
The SN54AHC16540 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74AHC16540 is characterized for operation from -40°C to 85°C.
These 16-bit buffers and bus drivers provide a high-performance bus interface for wide data paths.
The 3-state control gate is a 2-input AND gate with active-low inputs so that if either output-enable (OE1\ or OE2\) input is high, all corresponding outputs are in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE\ should be tied to VCCthrough a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
The SN54AHC16540 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74AHC16540 is characterized for operation from -40°C to 85°C.