FI-SEB20 Series

Catalog

CONN HEADER BRD EDGE 20P 1.25MM

Part	Contact Finish - Post	Contact Type	Features	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Insulation Height	Insulation Height	Shrouding	Termination	Voltage Rating	Current Rating (Amps)	Connector Type	Number of Rows	Mounting Type	Material Flammability Rating	Number of Positions	Insulation Color	Number of Positions Loaded	Fastening Type	Operating Temperature [Min]	Operating Temperature [Max]	Contact Shape	Contact Material	Style
JAE Electronics FI-SEB20P-HF10E	Tin or Tin-Alloy	Male Pin	Shielded Solder Retention	1.25 mm	0.049 in	Gold	1.95 mm	0.077 in	Shrouded - 4 Wall	Solder	200 V	1 A	Receptacle	1	Board Edge Cutout Surface Mount Right Angle	UL94 V-0	20	Beige	All	Friction Lock	-40 °C	80 C	Square	Copper Alloy	Board to Cable/Wire
JAE Electronics FI-SEB20P-HFE	Tin or Tin-Alloy	Male Pin	Shielded Solder Retention	1.25 mm	0.049 in	Gold	1.95 mm	0.077 in	Shrouded - 4 Wall	Solder	200 V	1 A	Receptacle	1	Board Edge Cutout Surface Mount Right Angle	UL94 V-0	20	Beige	All	Friction Lock	-40 °C	80 C	Square	Copper Alloy	Board to Cable/Wire
JAE Electronics FI-SEB20P-HFE-E3000	Tin or Tin-Alloy	Male Pin	Shielded Solder Retention	1.25 mm	0.049 in	Gold	1.95 mm	0.077 in	Shrouded - 4 Wall	Solder	200 V	1 A	Receptacle	1	Board Edge Cutout Surface Mount Right Angle	UL94 V-0	20	Beige	All	Friction Lock	-40 °C	80 C	Square	Copper Alloy	Board to Cable/Wire
JAE Electronics FI-SEB20P-HF13E	Tin or Tin-Alloy	Male Pin	Shielded Solder Retention	1.25 mm	0.049 in	Gold	1.95 mm	0.077 in	Shrouded - 4 Wall	Solder	200 V	1 A	Receptacle	1	Board Edge Cutout Surface Mount Right Angle	UL94 V-0	20	Beige	All	Friction Lock	-40 °C	80 C	Square	Copper Alloy	Board to Cable/Wire
JAE Electronics FI-SEB20P-HF13E-E3000	Tin or Tin-Alloy	Male Pin	Shielded Solder Retention	1.25 mm	0.049 in	Gold	1.95 mm	0.077 in	Shrouded - 4 Wall	Solder	200 V	1 A	Receptacle	1	Board Edge Cutout Surface Mount Right Angle	UL94 V-0	20	Beige	All	Friction Lock	-40 °C	80 C	Square	Copper Alloy	Board to Cable/Wire