SSW-117 Series

Catalog

CONN RCPT 51POS 0.1 GOLD PCB

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Part	Contact Type	Insulation Height	Contact Material	Contact Finish - Post	Insulation Color	Operating Temperature (Max)	Operating Temperature (Min)	Fastening Type	Contact Shape	Termination	Current Rating (Per Contact)	Material Flammability Rating	Pitch - Mating	Number of Rows	Number of Positions Loaded	Mounting Type	Contact Finish Thickness - Mating	Row Spacing - Mating	Insulation Material	Contact Finish - Mating	Style	Contact Length - Post	Connector Type	Number of Positions	Number of Positions Loaded	Contact Finish Thickness - Post
Samtec Inc. SSW-117-06-S-Q	Forked	0.335 in	Phosphor Bronze	Tin	Black	125 °C	-55 °C	Push-Pull	Square	Solder	4.7 A	UL94 V-0	0.1 in	3	34	Through Hole	30 µin	0.1 in	Liquid Crystal Polymer (LCP)	Gold	Board Board or Cable	0.124 in	Receptacle	51
Samtec Inc. SSW-117-01-S-D-032	Forked	0.335 in	Phosphor Bronze	Tin	Black	125 °C	-55 °C	Push-Pull	Square	Solder	4.7 A	UL94 V-0	0.1 in	2	33	Through Hole	30 µin	0.1 in	Liquid Crystal Polymer (LCP)	Gold	Board Board or Cable	0.104 in	Receptacle	34
Samtec Inc. SSW-117-06-G-D-LL	Forked	0.335 in	Phosphor Bronze	Gold	Black	125 °C	-55 °C	Push-Pull	Square	Kinked Pin Solder	4.7 A	UL94 V-0	0.1 in	2		Through Hole	20 Ąin	0.1 in	Liquid Crystal Polymer (LCP)	Gold	Board Board or Cable	0.124 in	Receptacle	34	All	3 µin
Samtec Inc. SSW-117-01-G-T	Forked	0.335 in	Phosphor Bronze	Gold	Black	125 °C	-55 °C	Push-Pull	Square	Solder	4.7 A	UL94 V-0	0.1 in	3		Through Hole	20 Ąin	0.1 in	Liquid Crystal Polymer (LCP)	Gold	Board Board or Cable	0.104 in	Receptacle	51	All	3 µin
Samtec Inc. SSW-117-02-S-S	Forked	0.335 in	Phosphor Bronze	Tin	Black	125 °C	-55 °C	Push-Pull	Square	Solder	4.7 A	UL94 V-0	0.1 in	1		Through Hole	30 µin		Liquid Crystal Polymer (LCP)	Gold	Board Board or Cable	0.194 in	Receptacle	17	All
Samtec Inc. SSW-117-03-L-D-RA	Forked	0.195 in	Phosphor Bronze	Tin	Black	125 °C	-55 °C	Push-Pull	Square	Solder	4.7 A	UL94 V-0	0.1 in	2		Right Angle Through Hole	10 µin	0.1 in	Liquid Crystal Polymer (LCP)	Gold	Board Board or Cable	0.3 in	Receptacle	34	All
Samtec Inc. SSW-117-04-F-S	Forked	0.335 in	Phosphor Bronze	Tin	Black	125 °C	-55 °C	Push-Pull	Square	Solder	4.7 A	UL94 V-0	0.1 in	1		Through Hole	3 µin		Liquid Crystal Polymer (LCP)	Gold	Board Board or Cable	0.584 in	Receptacle	17	All
Samtec Inc. SSW-117-21-G-D	Forked	0.335 in	Phosphor Bronze	Gold	Black	125 °C	-55 °C	Push-Pull	Square	Solder	4.7 A	UL94 V-0	0.1 in	2		Through Hole	20 Ąin	0.1 in	Liquid Crystal Polymer (LCP)	Gold	Board Board or Cable	0.104 in	Receptacle	34	All	3 µin
Samtec Inc. SSW-117-21-S-D	Forked	0.335 in	Phosphor Bronze	Tin	Black	125 °C	-55 °C	Push-Pull	Square	Solder	4.7 A	UL94 V-0	0.1 in	2		Through Hole	30 µin	0.1 in	Liquid Crystal Polymer (LCP)	Gold	Board Board or Cable	0.104 in	Receptacle	34	All
Samtec Inc. SSW-117-23-S-D-001	Forked	0.335 in	Phosphor Bronze	Tin	Black	125 °C	-55 °C	Push-Pull	Square	Solder	4.7 A	UL94 V-0	0.1 in	2	33	Through Hole	30 µin	0.1 in	Liquid Crystal Polymer (LCP)	Gold	Board Board or Cable	0.394 in	Receptacle	34