ESS-106 Series
Manufacturer: Samtec Inc.
CONN SOCKET STRIP SKT 6 POS 2.54MM SOLDER ST TOP ENTRY THRU-HOLE BULK
| Part | Number of Positions Loaded | Insulation Color | Fastening Type | Connector Type | Material Flammability Rating | Style | Number of Rows | Contact Finish Thickness - Mating | Pitch - Mating | Contact Finish - Post | Contact Finish - Mating | Number of Positions | Termination | Insulation Height | Contact Length - Post | Mounting Type | Operating Temperature (Max) | Operating Temperature (Min) | Contact Type | Contact Finish Thickness - Post | Insulation Material | Contact Material | Contact Shape |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | All | Black | Push-Pull | Elevated Socket | UL94 V-0 | Board | 1 | 10 µin | 0.1 in | Gold | Gold | 6 | Solder | 0.3 in | 0.373 in | Through Hole | 125 °C | -55 °C | Female Socket | 10 µin | Liquid Crystal Polymer (LCP) | Beryllium Copper | Circular |
Samtec Inc. | All | Black | Push-Pull | Elevated Socket | UL94 V-0 | Board | 1 | 10 µin | 0.1 in | Tin | Gold | 6 | Solder | 0.4 in | 0.123 in | Through Hole | 125 °C | -55 °C | Female Socket | Liquid Crystal Polymer (LCP) | Beryllium Copper | Circular | |
Samtec Inc. | All | Black | Push-Pull | Elevated Socket | UL94 V-0 | Board | 1 | 10 µin | 0.1 in | Gold | Gold | 6 | Solder | 0.5 in | 0.173 in | Through Hole | 125 °C | -55 °C | Female Socket | 10 µin | Liquid Crystal Polymer (LCP) | Beryllium Copper | Circular |
Samtec Inc. | All | Black | Push-Pull | Elevated Socket | UL94 V-0 | Board | 1 | 10 µin | 0.1 in | Tin | Gold | 6 | Solder | 0.3 in | 0.123 in | Through Hole | 125 °C | -55 °C | Female Socket | Liquid Crystal Polymer (LCP) | Beryllium Copper | Circular | |
Samtec Inc. | All | Black | Push-Pull | Elevated Socket | UL94 V-0 | Board | 1 | 10 µin | 0.1 in | Tin | Gold | 6 | Solder | 0.3 in | 0.123 in | Through Hole | 125 °C | -55 °C | Female Socket | Liquid Crystal Polymer (LCP) | Beryllium Copper | Circular | |
Samtec Inc. | All | Black | Push-Pull | Elevated Socket | UL94 V-0 | Board | 1 | 10 µin | 0.1 in | Gold | Gold | 6 | Solder | 0.4 in | 0.273 in | Through Hole | 125 °C | -55 °C | Female Socket | 10 µin | Liquid Crystal Polymer (LCP) | Beryllium Copper | Circular |
Samtec Inc. | All | Black | Push-Pull | Elevated Socket | UL94 V-0 | Board | 1 | 10 µin | 0.1 in | Gold | Gold | 6 | Solder | 0.3 in | 0.215 in | Through Hole | 125 °C | -55 °C | Female Socket | 10 µin | Liquid Crystal Polymer (LCP) | Beryllium Copper | Circular |
Samtec Inc. | All | Black | Push-Pull | Elevated Socket | UL94 V-0 | Board | 1 | 10 µin | 0.1 in | Gold | Gold | 6 | Solder | 0.3 in | 0.123 in | Through Hole | 125 °C | -55 °C | Female Socket | 10 µin | Liquid Crystal Polymer (LCP) | Beryllium Copper | Circular |
Samtec Inc. | All | Black | Push-Pull | Elevated Socket | UL94 V-0 | Board | 1 | 10 µin | 0.1 in | Gold | Gold | 6 | Solder | 0.3 in | 0.123 in | Through Hole | 125 °C | -55 °C | Female Socket | 10 µin | Liquid Crystal Polymer (LCP) | Beryllium Copper | Circular |
Samtec Inc. | All | Black | Push-Pull | Elevated Socket | UL94 V-0 | Board | 1 | 10 µin | 0.1 in | Tin | Gold | 6 | Solder | 0.5 in | 0.173 in | Through Hole | 125 °C | -55 °C | Female Socket | Liquid Crystal Polymer (LCP) | Beryllium Copper | Circular |