CONN RCPT 12POS 0.1 GOLD PCB
| Part | Insulation Height [z] | Insulation Height [z] | Insulation Color | Mounting Type | Fastening Type | Number of Rows | Operating Temperature [Min] | Operating Temperature [Max] | Contact Shape | Number of Positions | Contact Finish - Mating | Insulation Material | Contact Material | Contact Type | Connector Type | Number of Positions Loaded | Termination | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Mating | Pitch - Mating | Contact Length - Post [x] | Contact Length - Post [x] | Insulation Height | Insulation Height | Contact Finish - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Length - Post | Contact Length - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 0.095 in | 2.41 mm | Black | Through Hole | Push-Pull | 1 | -55 °C | 125 °C | Circular | 12 | Gold | Liquid Crystal Polymer (LCP) | Beryllium Copper | Female Socket | Receptacle | All | Solder | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | 2.41 mm | 0.095 in | |||||||
Samtec Inc. | Black | Through Hole | Push-Pull | 1 | -55 °C | 125 °C | Circular | 12 | Gold | Liquid Crystal Polymer (LCP) | Beryllium Copper | Female Socket | Receptacle | All | Solder | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | 2.08 mm | 0.082 " | 0.05 in | 1.27 mm | |||||||
Samtec Inc. | Black | Through Hole | Push-Pull | 1 | -55 °C | 125 °C | Circular | 12 | Gold | Liquid Crystal Polymer (LCP) | Beryllium Copper | Female Socket | Receptacle | All | Solder | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | 0.05 in | 1.27 mm | Gold | 10 çin | 0.25 çm | ||||||
Samtec Inc. | Black | Through Hole | Push-Pull | 1 | -55 °C | 105 ░C | Circular | 12 | Liquid Crystal Polymer (LCP) | Beryllium Copper | Female Socket | Receptacle | All | Solder | 0.1 in | 2.54 mm | 0.122 in | 3.1 mm | Tin | 0.108 in | 2.75 mm | |||||||||
Samtec Inc. | 0.095 in | 2.41 mm | Black | Through Hole | Push-Pull | 1 | -55 °C | 125 °C | Circular | 12 | Gold | Liquid Crystal Polymer (LCP) | Beryllium Copper | Female Socket | Receptacle | All | Solder | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | 2.41 mm | 0.095 in | Gold | 10 çin | 0.25 çm | ||||
Samtec Inc. | Black | Through Hole | Push-Pull | 1 | -55 °C | 125 °C | Circular | 12 | Gold | Liquid Crystal Polymer (LCP) | Beryllium Copper | Female Socket | Receptacle | All | Solder | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | 0.05 in | 1.27 mm | |||||||||
Samtec Inc. | Black | Through Hole | Push-Pull | 1 | -55 °C | 105 ░C | Circular | 12 | Liquid Crystal Polymer (LCP) | Beryllium Copper | Female Socket | Receptacle | All | Solder | 0.1 in | 2.54 mm | 0.132 in | 3.35 mm | Tin | 0.108 in | 2.75 mm | |||||||||
Samtec Inc. | Black | Through Hole | Push-Pull | 1 | -55 °C | 125 °C | Circular | 12 | Gold | Liquid Crystal Polymer (LCP) | Beryllium Copper | Female Socket | Receptacle | All | Solder | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | 0.05 in | 1.27 mm | |||||||||
Samtec Inc. | Black | Through Hole | Push-Pull | 1 | -55 °C | 105 ░C | Circular | 12 | Liquid Crystal Polymer (LCP) | Beryllium Copper | Female Socket | Receptacle | All | Solder | 0.1 in | 2.54 mm | 2.08 mm | 0.082 " | 0.05 in | 1.27 mm | ||||||||||
Samtec Inc. | Black | Through Hole | Push-Pull | 1 | -55 °C | 125 °C | Circular | 12 | Gold | Liquid Crystal Polymer (LCP) | Beryllium Copper | Female Socket | Receptacle | All | Solder | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | 0.132 in | 3.35 mm | 0.108 in | 2.75 mm |