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74LVC1G175 Series

Single D-Type Flip-Flop with Asynchronous Clear

Manufacturer: Texas Instruments

Catalog(5 parts)

PartCurrent - Quiescent (Iq)FunctionNumber of ElementsSupplier Device PackageTrigger TypePackage / CaseVoltage - SupplyVoltage - SupplyInput CapacitanceNumber of Bits per ElementCurrent - Output High, LowCurrent - Output High, LowOperating TemperatureOperating TemperatureTypeMax Propagation Delay @ V, Max CLOutput TypeMounting TypeSupplier Device PackageSupplier Device Package
Texas Instruments
74LVC1G175DCKRG4
Flip Flop 1 Element D-Type 1 Bit Positive Edge 6-TSSOP, SC-88, SOT-363
0.000009999999747378752 A
Reset
1 ul
SC-70-6
Positive Edge
6-TSSOP, SC-88, SOT-363
5.5 V
1.649999976158142 V
2.9999999880125916e-12 F
1 ul
0.03200000151991844 A
0.03200000151991844 A
-40 °C
125 °C
D-Type
3.999999886872274e-9 s
Non-Inverted
Surface Mount
Texas Instruments
SN74LVC1G175DRYR
Flip Flop 1 Element D-Type 1 Bit Positive Edge 6-UFDFN
0.000009999999747378752 A
Reset
1 ul
6-SON
Positive Edge
6-UFDFN
5.5 V
1.649999976158142 V
2.9999999880125916e-12 F
1 ul
0.03200000151991844 A
0.03200000151991844 A
-40 °C
125 °C
D-Type
4.999999969612645e-9 s
Non-Inverted
Surface Mount
1 ul
1.4500000476837158 ul
Texas Instruments
SN74LVC1G175DBVR
Flip Flop 1 Element D-Type 1 Bit Positive Edge SOT-23-6
0.000009999999747378752 A
Reset
1 ul
SOT-23-6
Positive Edge
SOT-23-6
5.5 V
1.649999976158142 V
2.9999999880125916e-12 F
1 ul
0.03200000151991844 A
0.03200000151991844 A
-40 °C
125 °C
D-Type
4.999999969612645e-9 s
Non-Inverted
Surface Mount
Texas Instruments
SN74LVC1G175DCKT
Flip Flop 1 Element D-Type 1 Bit Positive Edge 6-TSSOP, SC-88, SOT-363
0.000009999999747378752 A
Reset
1 ul
SC-70-6
Positive Edge
6-TSSOP, SC-88, SOT-363
5.5 V
1.649999976158142 V
2.9999999880125916e-12 F
1 ul
0.03200000151991844 A
0.03200000151991844 A
-40 °C
125 °C
D-Type
4.999999969612645e-9 s
Non-Inverted
Surface Mount
Texas Instruments
SN74LVC1G175DCKR
Flip Flop 1 Element D-Type 1 Bit Positive Edge 6-TSSOP, SC-88, SOT-363
0.000009999999747378752 A
Reset
1 ul
SC-70-6
Positive Edge
6-TSSOP, SC-88, SOT-363
5.5 V
1.649999976158142 V
2.9999999880125916e-12 F
1 ul
0.03200000151991844 A
0.03200000151991844 A
-40 °C
125 °C
D-Type
4.999999969612645e-9 s
Non-Inverted
Surface Mount

Key Features

Available in the Texas InstrumentsNanoFree™ PackageSupports 5-V VCCOperationInputs Accept Voltages to 5.5 VSupports Down Translation to VCCMax tpdof 4.3 ns at 3.3 VLow Power Consumption, 10-µA Max ICC±24-mA Output Drive at 3.3 VIoffSupports Live Insertion, Partial-Power-DownMode, and Back-Drive ProtectionLatch-Up Performance Exceeds 100 mA PerJESD 78, Class IIESD Protection Exceeds JESD 222000-V Human-Body Model (A114-A)200-V Machine Model (A115-A)1000-V Charged-Device Model (C101)Available in the Texas InstrumentsNanoFree™ PackageSupports 5-V VCCOperationInputs Accept Voltages to 5.5 VSupports Down Translation to VCCMax tpdof 4.3 ns at 3.3 VLow Power Consumption, 10-µA Max ICC±24-mA Output Drive at 3.3 VIoffSupports Live Insertion, Partial-Power-DownMode, and Back-Drive ProtectionLatch-Up Performance Exceeds 100 mA PerJESD 78, Class IIESD Protection Exceeds JESD 222000-V Human-Body Model (A114-A)200-V Machine Model (A115-A)1000-V Charged-Device Model (C101)

Description

AI
This single D-type flip-flop is designed for 1.65-V to 5.5-V VCCoperation. The SN74LVC1G175 device has an asynchronous clear (CLR) input. WhenCLRis high, data from the input pin (D) is transferred to the output pin (Q) on the clock's (CLK) rising edge. WhenCLRis low, Q is forced into the low state, regardless of the clock edge or data on D. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. This single D-type flip-flop is designed for 1.65-V to 5.5-V VCCoperation. The SN74LVC1G175 device has an asynchronous clear (CLR) input. WhenCLRis high, data from the input pin (D) is transferred to the output pin (Q) on the clock's (CLK) rising edge. WhenCLRis low, Q is forced into the low state, regardless of the clock edge or data on D. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.