CONN IC DIP SOCKET ZIF 48POS
| Part | Pitch - Post | Pitch - Post | Pitch - Mating | Pitch - Mating | Termination | Type | Type | Type | Material Flammability Rating | Features | Termination Post Length | Termination Post Length | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Current Rating (Amps) | Contact Finish - Mating | Contact Material - Mating | Number of Positions or Pins (Grid) | Contact Material - Post | Contact Finish - Post | Housing Material | Mounting Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Operating Temperature [Min] | Operating Temperature [Max] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics 48-6552-16 | 2.54 mm | 0.1 in | 0.1 in | 2.54 mm | Solder | 15.24 mm | DIP, ZIF (ZIP) | 0.6 " | UL94 V-0 | Closed Frame | 0.11 in | 2.78 mm | 1.27 µm | 50 µin | 1 A | Nickel Boron | Beryllium Copper | 48 | Beryllium Copper | Nickel Boron | Polyphenylene Sulfide (PPS), Glass Filled | Through Hole | 1.27 µm | 50 µin | ||
Aries Electronics 48-6552-10 | 2.54 mm | 0.1 in | 0.1 in | 2.54 mm | Solder | 15.24 mm | DIP, ZIF (ZIP) | 0.6 " | UL94 V-0 | Closed Frame | 0.11 in | 2.78 mm | 5.08 µm | 200 µin | 1 A | Beryllium Copper | 48 | Beryllium Copper | Tin | Polyphenylene Sulfide (PPS), Glass Filled | Through Hole | 5.08 µm | 200 µin | |||
Aries Electronics 48-6552-11 | 2.54 mm | 0.1 in | 0.1 in | 2.54 mm | Solder | 15.24 mm | DIP, ZIF (ZIP) | 0.6 " | UL94 V-0 | Closed Frame | 0.11 in | 2.78 mm | 1 A | Gold | Beryllium Copper | 48 | Beryllium Copper | Gold | Polyphenylene Sulfide (PPS), Glass Filled | Through Hole | ||||||
Aries Electronics 48-6552-18 | 2.54 mm | 0.1 in | 0.1 in | 2.54 mm | Solder | 15.24 mm | DIP, ZIF (ZIP) | 0.6 " | UL94 V-0 | Closed Frame | 0.11 in | 2.78 mm | 1.27 µm | 50 µin | 1 A | Nickel Boron | Beryllium Nickel | 48 | Beryllium Nickel | Nickel Boron | Polyetheretherketone (PEEK), Glass Filled | Through Hole | 1.27 µm | 50 µin | -55 °C | 250 °C |