48-6552-10

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Aries Electronics

CONN IC DIP SOCKET ZIF 48POS TIN

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Aries Electronics

CONN IC DIP SOCKET ZIF 48POS TIN

Technical Specifications

Parameters and characteristics for this part

Specification	48-6552-10

Contact Finish - Post	Tin
Contact Finish Thickness - Mating	5.08 µm
Contact Finish Thickness - Mating	200 µin
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Current Rating (Amps)	1 A
Features	Closed Frame
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	48
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	0.11 in
Termination Post Length	2.78 mm
Type	15.24 mm
Type	DIP, ZIF (ZIP)
Type	0.6 "

Part	Contact Finish - Post	Material Flammability Rating	Number of Positions or Pins (Grid)	Type	Type	Type	Termination Post Length	Termination Post Length	Pitch - Post	Pitch - Post	Contact Material - Post	Current Rating (Amps)	Termination	Contact Finish - Mating	Features	Contact Material - Mating	Pitch - Mating	Pitch - Mating	Housing Material	Mounting Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 48-6552-11	Gold	UL94 V-0	48	15.24 mm	DIP ZIF (ZIP)	0.6 "	0.11 in	2.78 mm	2.54 mm	0.1 in	Beryllium Copper	1 A	Solder	Gold	Closed Frame	Beryllium Copper	0.1 in	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled	Through Hole
Aries Electronics 48-6552-10	Tin	UL94 V-0	48	15.24 mm	DIP ZIF (ZIP)	0.6 "	0.11 in	2.78 mm	2.54 mm	0.1 in	Beryllium Copper	1 A	Solder		Closed Frame	Beryllium Copper	0.1 in	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled	Through Hole	200 µin	5.08 µm	5.08 µm	200 µin
Aries Electronics 48-6552-18	Nickel Boron	UL94 V-0	48	15.24 mm	DIP ZIF (ZIP)	0.6 "	0.11 in	2.78 mm	2.54 mm	0.1 in	Beryllium Nickel	1 A	Solder	Nickel Boron	Closed Frame	Beryllium Nickel	0.1 in	2.54 mm	Polyetheretherketone (PEEK) Glass Filled	Through Hole	50 µin	1.27 µm	1.27 µm	50 µin	-55 °C	250 °C

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	24	$ 17.51

General part information

48 (2 x 24) Pos DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Socket Tin Through Hole

Technical documentation and resources