116-83 Series

Catalog

CONN IC DIP SOCKET 28POS GOLD

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Part	Mounting Type	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Material Flammability Rating	Termination Post Length	Termination Post Length	Contact Material - Mating	Housing Material	Contact Resistance	Number of Positions or Pins (Grid)	Pitch - Post	Pitch - Post	Contact Material - Post [custom]	Termination	Contact Finish - Post	Type	Type	Type	Contact Finish - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Current Rating (Amps)	Features	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]
PRECI-DIP SA 116-83-328-41-003101	Through Hole	0.1 in	2.54 mm	29.5 Áin	0.75 Ám	UL94 V-0	3.18 mm	0.125 in	Beryllium Copper	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	10 mOhm	28	2.54 mm	0.1 in	Brass	Solder	Tin	0.3 "	7.62 mm	DIP	Gold	-55 °C	125 °C	1 A	Elevated Open Frame
PRECI-DIP SA 116-83-304-41-003101	Through Hole	0.1 in	2.54 mm	29.5 Áin	0.75 Ám	UL94 V-0	3.18 mm	0.125 in	Beryllium Copper	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	10 mOhm		2.54 mm	0.1 in	Brass	Solder	Tin	0.3 "	7.62 mm	DIP	Gold	-55 °C	125 °C	1 A	Elevated Open Frame	4
PRECI-DIP SA 116-83-420-41-006101	Through Hole	0.1 in	2.54 mm	29.5 Áin	0.75 Ám	UL94 V-0	3.18 mm	0.125 in	Beryllium Copper	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	10 mOhm	20	2.54 mm	0.1 in	Brass	Solder	Tin	0.4 in	10.16 mm	DIP	Gold	-55 °C	125 °C	1 A	Elevated Open Frame
PRECI-DIP SA 116-83-308-41-011101	Through Hole	0.1 in	2.54 mm	29.5 Áin	0.75 Ám	UL94 V-0	3.18 mm	0.125 in	Beryllium Copper	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	10 mOhm	8	2.54 mm	0.1 in	Brass	Solder	Tin	0.3 "	7.62 mm	DIP	Gold	-55 °C	125 °C	1 A	Elevated Open Frame
PRECI-DIP SA 116-83-322-41-008101	Through Hole	0.1 in	2.54 mm	29.5 Áin	0.75 Ám	UL94 V-0	3.18 mm	0.125 in	Beryllium Copper	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	10 mOhm	22	2.54 mm	0.1 in	Brass	Solder	Tin	0.3 "	7.62 mm	DIP	Gold	-55 °C	125 °C	1 A	Elevated Open Frame
PRECI-DIP SA 116-83-640-41-006101	Through Hole	0.1 in	2.54 mm	29.5 Áin	0.75 Ám	UL94 V-0	3.18 mm	0.125 in	Beryllium Copper	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	10 mOhm	40	2.54 mm	0.1 in	Brass	Solder	Tin	0.6 in	15.24 mm	DIP	Gold	-55 °C	125 °C	1 A	Elevated Open Frame		20	2
PRECI-DIP SA 116-83-420-41-007101	Through Hole	0.1 in	2.54 mm	29.5 Áin	0.75 Ám	UL94 V-0	3.18 mm	0.125 in	Beryllium Copper	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	10 mOhm	20	2.54 mm	0.1 in	Brass	Solder	Tin	0.4 in	10.16 mm	DIP	Gold	-55 °C	125 °C	1 A	Elevated Open Frame
PRECI-DIP SA 116-83-632-41-008101	Through Hole	0.1 in	2.54 mm	29.5 Áin	0.75 Ám	UL94 V-0	3.18 mm	0.125 in	Beryllium Copper	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	10 mOhm		2.54 mm	0.1 in	Brass	Solder	Tin	0.6 in	15.24 mm	DIP	Gold	-55 °C	125 °C	1 A	Elevated Open Frame				2 x 16	32
PRECI-DIP SA 116-83-636-41-011101	Through Hole	0.1 in	2.54 mm	29.5 Áin	0.75 Ám	UL94 V-0	3.18 mm	0.125 in	Beryllium Copper	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	10 mOhm	36	2.54 mm	0.1 in	Brass	Solder	Tin	0.6 in	15.24 mm	DIP	Gold	-55 °C	125 °C	1 A	Elevated Open Frame
PRECI-DIP SA 116-83-304-41-011101	Through Hole	0.1 in	2.54 mm	29.5 Áin	0.75 Ám	UL94 V-0	3.18 mm	0.125 in	Beryllium Copper	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	10 mOhm		2.54 mm	0.1 in	Brass	Solder	Tin	0.3 "	7.62 mm	DIP	Gold	-55 °C	125 °C	1 A	Elevated Open Frame	4