R/A SMT PCIE GEN4
| Part | Number of Rows | Termination | Contact Material | Gender | Color | Contact Finish | Number of Positions/Bay/Row [custom] | Features | Material - Insulation | Pitch [x] | Pitch [x] | Termination Rows | Number of Positions | Contact Finish Thickness | Contact Finish Thickness | Card Type | Read Out | Mounting Type | Operating Temperature [Max] | Operating Temperature [Min] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Amphenol ICC (FCI) | 2 | Solder | Copper Alloy | Female | Black | Gold | 82 | Board Guide | Liquid Crystal Polymer (LCP) | 0.039 in | 1 mm | 2 | 164 | 15 µin | 0.38 µm | PCI Express™ | Dual | Surface Mount Right Angle | ||
Amphenol ICC (FCI) | 2 | Solder | Copper Alloy | Female | Black | Gold | 49 | Board Guide | Liquid Crystal Polymer (LCP) | 0.039 in | 1 mm | 2 | 98 | 15 µin | 0.38 µm | PCI Express™ | Dual | Surface Mount Right Angle | ||
Amphenol ICC (FCI) | 2 | Solder | Copper Alloy | Female | Black | Gold | Board Guide Solder Retention | Liquid Crystal Polymer (LCP) Glass Filled | 0.039 in | 1 mm | 164 | 30 Áin | 0.76 Ám | PCI Express™ | Dual | Surface Mount Right Angle | 105 ░C | -55 °C |