SL-105 Series

Catalog

CONN RCPT 5POS 0.1 GOLD PCB

Part	Connector Type	Contact Type	Insulation Height	Fastening Type	Pitch - Mating	Insulation Color	Contact Finish Thickness - Mating	Termination	Contact Length - Post	Number of Positions	Operating Temperature (Max)	Operating Temperature (Min)	Contact Finish - Mating	Style	Number of Rows	Number of Positions Loaded	Contact Finish - Post	Mounting Type	Insulation Material	Contact Shape	Contact Material	Contact Finish Thickness - Post
Samtec Inc. SL-105-G-10	Receptacle	Female Socket	0.122 in	Push-Pull	0.1 in	Black	30 µin	Solder	0.108 in	5	125 °C	-55 °C	Gold	Board	1	All	Gold	Through Hole	Liquid Crystal Polymer (LCP)	Circular	Beryllium Copper	10 µin
Samtec Inc. SL-105-T-31	Receptacle	Female Socket	0.05 in	Push-Pull	0.1 in	Black	30 µin	Solder		5	125 °C	-55 °C	Gold	Board	1	All		Through Hole	Liquid Crystal Polymer (LCP)	Circular	Beryllium Copper
Samtec Inc. SL-105-T-19	Receptacle	Female Socket	0.083 in	Push-Pull	0.1 in	Black	30 µin	Solder	0.082 in	5	125 °C	-55 °C	Gold	Board	1	All		Through Hole	Liquid Crystal Polymer (LCP)	Circular	Beryllium Copper
Samtec Inc. SL-105-T-32	Receptacle	Female Socket	0.05 in	Push-Pull	0.1 in	Black	30 µin	Solder		5	125 °C	-55 °C	Gold	Board	1	All		Through Hole	Liquid Crystal Polymer (LCP)	Circular	Beryllium Copper
Samtec Inc. SL-105-T-11	Receptacle	Female Socket	0.132 in	Push-Pull	0.1 in	Black	30 µin	Solder	0.108 in	5	125 °C	-55 °C	Gold	Board	1	All		Through Hole	Liquid Crystal Polymer (LCP)	Circular	Beryllium Copper
Samtec Inc. SL-105-TT-11	Receptacle	Female Socket	0.132 in	Push-Pull	0.1 in	Black		Solder	0.108 in	5	105 °C	-55 °C	Tin	Board	1	All	Tin	Through Hole	Liquid Crystal Polymer (LCP)	Circular	Beryllium Copper
Samtec Inc. SL-105-G-31	Receptacle	Female Socket	0.05 in	Push-Pull	0.1 in	Black	30 µin	Solder		5	125 °C	-55 °C	Gold	Board	1	All	Gold	Through Hole	Liquid Crystal Polymer (LCP)	Circular	Beryllium Copper	10 µin