CONN RCPT 5POS 0.1 GOLD PCB
| Part | Termination | Contact Finish - Mating | Insulation Color | Fastening Type | Insulation Material | Connector Type | Insulation Height | Insulation Height | Operating Temperature [Min] | Operating Temperature [Max] | Contact Shape | Number of Positions Loaded | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Number of Rows | Contact Material | Contact Type | Pitch - Mating | Pitch - Mating | Mounting Type | Contact Length - Post | Contact Length - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Solder | Gold | Black | Push-Pull | Liquid Crystal Polymer (LCP) | Receptacle | 0.05 in | 1.27 mm | -55 °C | 125 °C | Circular | All | 30 Áin | 0.76 Ám | 1 | Beryllium Copper | Female Socket | 0.1 in | 2.54 mm | Through Hole | |||||
Samtec Inc. | Solder | Gold | Black | Push-Pull | Liquid Crystal Polymer (LCP) | Receptacle | 0.05 in | 1.27 mm | -55 °C | 125 °C | Circular | All | 30 Áin | 0.76 Ám | 1 | Beryllium Copper | Female Socket | 0.1 in | 2.54 mm | Through Hole | |||||
Samtec Inc. | Solder | Gold | Black | Push-Pull | Liquid Crystal Polymer (LCP) | Receptacle | 0.132 in | 3.35 mm | -55 °C | 125 °C | Circular | All | 30 Áin | 0.76 Ám | 1 | Beryllium Copper | Female Socket | 0.1 in | 2.54 mm | Through Hole | 0.108 in | 2.75 mm | |||
Samtec Inc. | Solder | Gold | Black | Push-Pull | Liquid Crystal Polymer (LCP) | Receptacle | 0.05 in | 1.27 mm | -55 °C | 125 °C | Circular | All | 30 Áin | 0.76 Ám | 1 | Beryllium Copper | Female Socket | 0.1 in | 2.54 mm | Through Hole | 10 çin | 0.25 çm | Gold | ||
Samtec Inc. | Solder | Black | Push-Pull | Liquid Crystal Polymer (LCP) | Receptacle | 0.122 in | 3.1 mm | -55 °C | 105 ░C | Circular | All | 1 | Beryllium Copper | Female Socket | 0.1 in | 2.54 mm | Through Hole | 0.108 in | 2.75 mm | Tin |