CONN HEADER SMD 10POS 2MM
Part | Contact Material | Shrouding | Insulation Height [z] | Insulation Height [z] | Contact Shape | Mounting Type | Contact Finish - Mating | Number of Rows | Operating Temperature [Max] | Operating Temperature [Min] | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Length - Mating | Contact Length - Mating | Row Spacing - Mating | Row Spacing - Mating | Connector Type | Contact Finish - Post | Number of Positions Loaded | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Insulation Color | Contact Type | Number of Positions | Termination | Material Flammability Rating | Fastening Type | Pitch - Mating [x] | Pitch - Mating [x] | Contact Length - Post | Contact Length - Post | Style | Overall Contact Length | Overall Contact Length | Features |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Copper Alloy | Unshrouded | 0.06 in | 1.52 mm | Square | Surface Mount | Gold | 2 | 105 ░C | -55 °C | 30 Áin | 0.76 Ám | 3.86 mm | 0.152 in | 0.079 in | 2 mm | Header | Tin | All | 200 µin | 5.08 µm | Black | Male Pin | 10 | Solder | UL94 V-0 | Push-Pull | 0.079 in | 2 mm | |||||||
Copper Alloy | Unshrouded | 0.06 in | 1.52 mm | Square | Through Hole | Gold | 2 | 105 ░C | -55 °C | 30 Áin | 0.76 Ám | 3.3 mm | 0.13 in | 0.079 in | 2 mm | Header | Tin-Lead | All | 200 µin | 5.08 µm | Black | Male Pin | 10 | Solder | UL94 V-0 | Push-Pull | 0.079 in | 2 mm | 0.118 in | 3 mm | Board to Board, Cable | 0.307 in | 7.8 mm | ||
Copper Alloy | Unshrouded | 0.165 in | 4.2 mm | Square | Through Hole, Right Angle | Gold | 2 | 105 ░C | -55 °C | 30 Áin | 0.76 Ám | 3.86 mm | 0.152 in | 0.079 in | 2 mm | Header | Tin | All | 200 µin | 5.08 µm | Black | Male Pin | 10 | Solder | UL94 V-0 | Push-Pull | 0.079 in | 2 mm | 0.118 in | 3 mm | Board to Board, Cable | ||||
Copper Alloy | Unshrouded | 0.165 in | 4.2 mm | Square | Through Hole, Right Angle | Gold | 2 | 105 ░C | -55 °C | 15 µin | 0.38 µm | 3.3 mm | 0.13 in | 0.079 in | 2 mm | Header | Tin-Lead | All | 200 µin | 5.08 µm | Black | Male Pin | 10 | Solder | UL94 V-0 | Push-Pull | 0.079 in | 2 mm | 0.118 in | 3 mm | Board to Board, Cable | ||||
Copper Alloy | Unshrouded | 0.06 in | 1.52 mm | Square | Through Hole | Gold | 2 | 105 ░C | -55 °C | 30 Áin | 0.76 Ám | 3.86 mm | 0.152 in | 0.079 in | 2 mm | Header | Tin-Lead | All | 200 µin | 5.08 µm | Black | Male Pin | 10 | Solder | UL94 V-0 | Push-Pull | 0.079 in | 2 mm | 0.118 in | 3 mm | Board to Board, Cable | 0.329 in | 8.36 mm | ||
Copper Alloy | Unshrouded | 0.06 in | 1.52 mm | Square | Surface Mount | Gold | 2 | 105 ░C | -55 °C | 30 Áin | 0.76 Ám | 3.86 mm | 0.152 in | 0.079 in | 2 mm | Header | Tin-Lead | All | 200 µin | 5.08 µm | Black | Male Pin | 10 | Solder | UL94 V-0 | Push-Pull | 0.079 in | 2 mm | |||||||
Copper Alloy | Unshrouded | 0.06 in | 1.52 mm | Square | Surface Mount | Gold | 2 | 105 ░C | -55 °C | 30 Áin | 0.76 Ám | 3.86 mm | 0.152 in | 0.079 in | 2 mm | Header | Tin | All | 200 µin | 5.08 µm | Black | Male Pin | 10 | Solder | UL94 V-0 | Push-Pull | 0.079 in | 2 mm | Pick and Place |