CONN RCPT 27POS 0.079 GOLD PCB
| Part | Contact Finish - Mating | Contact Shape | Contact Finish - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Number of Positions Loaded | Mounting Type | Voltage Rating | Operating Temperature [Min] | Operating Temperature [Max] | Contact Length - Post [x] | Contact Length - Post [x] | Material Flammability Rating | Number of Rows | Termination | Insulation Material | Current Rating (Amps) | Insulation Height | Insulation Height | Number of Positions | Insulation Color | Connector Type | Fastening Type | Contact Material | Contact Type | Pitch - Mating [x] | Pitch - Mating [x] | Style | Row Spacing - Mating | Row Spacing - Mating | Features |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Gold | Square | Tin | 30 Áin | 0.76 Ám | All | Through Hole | 350 VAC | -55 °C | 125 °C | 0.12 in | 3.05 mm | UL94 V-0 | 1 | Solder | Liquid Crystal Polymer (LCP) | 3.2 A | 3.56 mm | 0.14 in | 27 | Black | Receptacle | Push-Pull | Beryllium Copper | Female Socket | 0.079 in | 2 mm | Board to Board Cable | |||
Samtec Inc. | Gold | Square | Tin | 30 Áin | 0.76 Ám | All | Surface Mount | 350 VAC | -55 °C | 125 °C | UL94 V-0 | 2 | Solder | Liquid Crystal Polymer (LCP) | 3.2 A | 3.56 mm | 0.14 in | 54 | Black | Receptacle | Push-Pull | Beryllium Copper | Female Socket | 0.079 in | 2 mm | Board to Board Cable | 0.079 in | 2 mm | |||
Samtec Inc. | Gold | Square | Tin | 30 Áin | 0.76 Ám | Through Hole | 350 VAC | -55 °C | 125 °C | 0.12 in | 3.05 mm | UL94 V-0 | 2 | Solder | Liquid Crystal Polymer (LCP) | 3.2 A | 3.56 mm | 0.14 in | 54 | Black | Receptacle | Push-Pull | Beryllium Copper | Female Socket | 0.079 in | 2 mm | Board to Board Cable | 0.079 in | 2 mm | ||
Samtec Inc. | Gold | Square | Tin | 3 µin | 0.076 µm | All | Through Hole | 350 VAC | -55 °C | 125 °C | 0.12 in | 3.05 mm | UL94 V-0 | 2 | Solder | Liquid Crystal Polymer (LCP) | 3.2 A | 3.56 mm | 0.14 in | 54 | Black | Receptacle | Push-Pull | Beryllium Copper | Female Socket | 0.079 in | 2 mm | Board to Board Cable | 0.079 in | 2 mm | |
Samtec Inc. | Gold | Square | Tin | 30 Áin | 0.76 Ám | All | Surface Mount | 350 VAC | -55 °C | 125 °C | UL94 V-0 | 2 | Solder | Liquid Crystal Polymer (LCP) | 3.2 A | 3.56 mm | 0.14 in | 54 | Black | Receptacle | Push-Pull | Beryllium Copper | Female Socket | 0.079 in | 2 mm | Board to Board Cable | 0.079 in | 2 mm | Pick and Place | ||
Samtec Inc. | Gold | Square | Tin | 10 çin | 0.25 çm | All | Through Hole | 350 VAC | -55 °C | 125 °C | 0.12 in | 3.05 mm | UL94 V-0 | 2 | Solder | Liquid Crystal Polymer (LCP) | 3.2 A | 3.56 mm | 0.14 in | 54 | Black | Receptacle | Push-Pull | Beryllium Copper | Female Socket | 0.079 in | 2 mm | Board to Board Cable | 0.079 in | 2 mm | |
Samtec Inc. | Gold | Square | Tin | 30 Áin | 0.76 Ám | Through Hole | 350 VAC | -55 °C | 125 °C | 0.12 in | 3.05 mm | UL94 V-0 | 2 | Solder | Liquid Crystal Polymer (LCP) | 3.2 A | 3.56 mm | 0.14 in | 54 | Black | Receptacle | Push-Pull | Beryllium Copper | Female Socket | 0.079 in | 2 mm | Board to Board Cable | 0.079 in | 2 mm |