SDM1A30CSP Series

1A SCHOTTKY BARRIER RECTIFER CHIP SCALE PACKAGE

Catalog

1A SCHOTTKY BARRIER RECTIFER CHIP SCALE PACKAGE

Part	Voltage - DC Reverse (Vr) (Max) [Max]	Mounting Type	Operating Temperature - Junction [Max]	Operating Temperature - Junction [Min]	Capacitance @ Vr, F	Current - Average Rectified (Io)	Package / Case	Speed	Current - Reverse Leakage @ Vr	Technology	Voltage - Forward (Vf) (Max) @ If	Supplier Device Package
Diodes Inc SDM1A30CSP-7	30 V	Surface Mount	150 °C	-55 °C	40 pF	1 A	2-XDFN	200 mA 500 ns	100 µA	Schottky	525 mV	X3-WLB1006-2

Catalog

1A SCHOTTKY BARRIER RECTIFER CHIP SCALE PACKAGE

Key Features

• Off Board Profile of 0.275mm — More than 30% Thinner than DFN1006

• Low Forward Voltage (VF) Minimizes Conduction Losses and Improves Efficiency

• Reduced High Temperature Reverse Leakage; Increased Reliability Against Thermal Runaway Failure in High Temperature Operation

Description

The SDM1A30CSP is a 30V 1A Schottky barrier rectifier that is optimized for low forward voltage drop and low-leakage current, housed in a compact chip scale package (CSP) that occupies only 0.6mm2 board space. The low thermal resistance enables designers to meet design challenges of increasing efficiency while also reducing board space.