Beta
⌘K
SOLDERCUP SPRING-LOADED PIN
| Part | Contact Finish Thickness | Contact Finish Thickness | Current Rating (Amps) | Features | Minimum Working Height [Min] | Minimum Working Height [Min] | Operating Force - Mid Compression | Pad Layout Dimension [diameter] | Pad Layout Dimension [diameter] | Maximum Working Height [Max] | Maximum Working Height [Max] | Contact Material | Mating Cycles | Recommended Working Height [z] | Recommended Working Height [z] | Plunger Size [diameter] | Plunger Size [diameter] | Operating Temperature [Min] | Operating Temperature [Max] | Contact Type | Mounting Type | Contact Finish |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Mill-Max Manufacturing Corp. | 0.51 µm | 20 µin | 5.2 A | 26 AWG | 0.174 in | 4.42 mm | 60 gf | 1.07 mm | 0.042 in | 6.53 mm | 0.257 in | Brass Alloy | 1000000 | 5.13 mm | 0.202 " | 0.48 mm | 0.019 in | -55 °C | 125 °C | Sleeve & Plunger (Pogo Pins) | Solder Cup Through Hole | Gold |