TRANS IGBT CHIP N-CH 600V 3-PIN DIE WAFER
| Part | Mounting Type | Operating Temperature [Min] | Operating Temperature [Max] | IGBT Type | Package / Case | Vce(on) (Max) @ Vge, Ic | Supplier Device Package | Voltage - Collector Emitter Breakdown (Max) [Max] | Current - Collector Pulsed (Icm) | Current - Collector (Ic) (Max) [Max] |
|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies | Surface Mount | -40 C | 175 °C | Trench Field Stop | Die | 1.85 V | Die | 600 V | 225 A | 75 A |