IGBT 3 CHIP 600V WAFER
| Part | Current - Collector (Ic) (Max) [Max] | Voltage - Collector Emitter Breakdown (Max) [Max] | Current - Collector Pulsed (Icm) | Vce(on) (Max) @ Vge, Ic | Mounting Type | Td (on/off) @ 25°C | Td (on/off) @ 25°C | Supplier Device Package | IGBT Type | Test Condition | Package / Case | Operating Temperature [Min] | Operating Temperature [Max] | Td (on/off) @ 25°C |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies | 100 A | 600 V | 300 A | 2.5 V | Surface Mount | 450 ns | 65 ns | Die | NPT | 3.3 Ohm 15 V 100 A 400 V | Die | -55 °C | 150 °C | |
Infineon Technologies | 100 A | 600 V | 300 A | 2.5 V | Surface Mount | Die | NPT | 2.2 Ohm 15 V 100 A 300 V | Die | -55 °C | 150 °C | 95 ns 200 ns | ||
Infineon Technologies | 100 A | 600 V | 300 A | 2.5 V | Surface Mount | Die | NPT | 2.2 Ohm 15 V 100 A 300 V | Die | -55 °C | 150 °C | 95 ns 200 ns | ||
Infineon Technologies | 100 A | 600 V | 300 A | 2.5 V | Surface Mount | 450 ns | 65 ns | Die | NPT | 3.3 Ohm 15 V 100 A 400 V | Die | -55 °C | 150 °C | |
Infineon Technologies | 100 A | 600 V | 300 A | 2.5 V | Surface Mount | Die | NPT | 2.2 Ohm 15 V 100 A 300 V | Die | -55 °C | 150 °C | 95 ns 200 ns |