1437535 Series

Manufacturer: TE Connectivity AMP Connectors

Catalog

CONN IC DIP SOCKET 8POS TIN

Part	Termination Post Length	Contact Resistance	Contact Finish - Mating	Contact Finish - Post	Pitch - Post	Grid Columns	Grid Rows	Number of Positions or Pins (Grid)	Contact Material - Mating	Row Spacing	Type	Mounting Type	Contact Material - Post	Operating Temperature (Min)	Operating Temperature (Max)	Features	Termination	Pitch - Mating	Material Flammability Rating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Housing Material
TE Connectivity AMP Connectors 1-1437535-9	0.125 in	10 mOhm	Tin	Tin	0.1 in	4	2	8	Beryllium Copper	0.3 in	0.3" (7.62mm) Row Spacing DIP	Through Hole	Brass	-55 °C	105 °C	Closed Frame	Solder	0.1 in
TE Connectivity AMP Connectors 7-1437535-0	0.125 in		Gold	Tin-Lead	0.1 in	14	1	14	Beryllium Copper		SIP	Through Hole	Beryllium Copper	-55 °C	125 °C	Closed Frame	Solder	0.1 in	UL94 V-0	10 µin	10 µin	Polyester
TE Connectivity AMP Connectors 9-1437535-1	0.125 in	10 mOhm	Gold	Gold	0.1 in	7	2	14	Beryllium Copper	0.3 in	0.3" (7.62mm) Row Spacing DIP	Through Hole	Copper Alloy	-55 °C	125 °C	Closed Frame	Solder	0.1 in	UL94 V-0	25 µin	25 µin
TE Connectivity AMP Connectors 9-1437535-4	0.125 in	10 mOhm	Gold	Gold	0.1 in	7	2	14	Beryllium Copper	0.3 in	0.3" (7.62mm) Row Spacing DIP	Through Hole	Beryllium Copper	-55 °C	125 °C	Closed Frame	Solder	0.1 in		25 µin	25 µin
TE Connectivity AMP Connectors 6-1437535-3	0.125 in		Gold	Gold	0.1 in	8	1	8	Beryllium Copper		SIP	Through Hole	Beryllium Copper			Closed Frame	Solder	0.1 in	UL94 V-0	10 µin	10 µin	Thermoplastic
TE Connectivity AMP Connectors 5-1437535-4	0.125 in		Gold	Gold	0.1 in	20	1	20	Beryllium Copper		SIP	Through Hole	Beryllium Copper			Closed Frame	Solder	0.1 in	UL94 V-0	10 µin	10 µin