14-3518 Series

Catalog

CONN IC DIP SOCKET 14POS GOLD

Part	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Housing Material	Contact Material - Post [custom]	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination Post Length	Termination Post Length	Mounting Type	Features	Current Rating (Amps)	Termination	Contact Material - Mating	Type	Type	Type	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Contact Finish - Post	Number of Positions or Pins (Grid)	Material Flammability Rating	Pitch - Post	Pitch - Post
Aries Electronics 14-3518-10T	200 µin	5.08 µm	Glass Filled Nylon 4/6 Polyamide (PA46)	Brass	10 çin	0.25 çm	3.18 mm	0.125 in	Through Hole	Open Frame	3 A	Solder	Beryllium Copper	0.3 "	7.62 mm	DIP	0.1 in	2.54 mm	Gold	Tin	14	UL94 V-0	2.54 mm	0.1 in
Aries Electronics 14-3518-112	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	Brass	10 çin	0.25 çm	3.18 mm	0.125 in	Through Hole	Open Frame	3 A	Solder	Beryllium Copper	0.3 "	7.62 mm	DIP	0.1 in	2.54 mm	Gold	Gold	14	UL94 V-0	2.54 mm	0.1 in
Aries Electronics 14-3518-10	200 µin	5.08 µm	Glass Filled Nylon 4/6 Polyamide (PA46)	Brass	10 çin	0.25 çm	3.18 mm	0.125 in	Through Hole	Open Frame	3 A	Solder	Beryllium Copper	0.3 "	7.62 mm	DIP	0.1 in	2.54 mm	Gold	Tin	14	UL94 V-0	2.54 mm	0.1 in
Aries Electronics 14-3518-101	200 µin	5.08 µm	Glass Filled Nylon 4/6 Polyamide (PA46)	Brass	10 çin	0.25 çm	3.18 mm	0.125 in	Through Hole	Open Frame	3 A	Solder	Beryllium Copper	0.3 "	7.62 mm	DIP	0.1 in	2.54 mm	Gold	Tin	14	UL94 V-0	2.54 mm	0.1 in
Aries Electronics 14-3518-111	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	Brass	10 çin	0.25 çm	3.18 mm	0.125 in	Through Hole	Open Frame	3 A	Solder	Beryllium Copper	0.3 "	7.62 mm	DIP	0.1 in	2.54 mm	Gold	Gold	14	UL94 V-0	2.54 mm	0.1 in
Aries Electronics 14-3518-01	200 µin	5.08 µm	Glass Filled Nylon 4/6 Polyamide (PA46)	Brass	10 çin	0.25 çm	3.18 mm	0.125 in	Through Hole	Open Frame	3 A	Solder	Beryllium Copper	0.3 "	7.62 mm	DIP	0.1 in	2.54 mm	Gold	Tin	14	UL94 V-0	2.54 mm	0.1 in
Aries Electronics 14-3518-00	200 µin	5.08 µm	Glass Filled Nylon 4/6 Polyamide (PA46)	Brass	10 çin	0.25 çm	3.18 mm	0.125 in	Surface Mount	Open Frame	3 A	Solder	Beryllium Copper	0.3 "	7.62 mm	DIP	0.1 in	2.54 mm	Gold	Tin	14	UL94 V-0	2.54 mm	0.1 in
Aries Electronics 14-3518-101H	200 µin	5.08 µm	Glass Filled Nylon 4/6 Polyamide (PA46)	Brass	10 çin	0.25 çm	3.18 mm	0.125 in	Through Hole	Open Frame	3 A	Solder	Beryllium Copper	0.3 "	7.62 mm	DIP	0.1 in	2.54 mm	Gold	Tin	14	UL94 V-0	2.54 mm	0.1 in
Aries Electronics 14-3518-102	200 µin	5.08 µm	Glass Filled Nylon 4/6 Polyamide (PA46)	Brass	10 çin	0.25 çm	3.18 mm	0.125 in	Through Hole	Open Frame	3 A	Solder	Beryllium Copper	0.3 "	7.62 mm	DIP	0.1 in	2.54 mm	Gold	Tin	14	UL94 V-0	2.54 mm	0.1 in
Aries Electronics 14-3518-10M	200 µin	5.08 µm	Glass Filled Nylon 4/6 Polyamide (PA46)	Brass	10 çin	0.25 çm	3.18 mm	0.125 in	Through Hole	Open Frame	3 A	Solder	Beryllium Copper	0.3 "	7.62 mm	DIP	0.1 in	2.54 mm	Gold	Tin	14	UL94 V-0	2.54 mm	0.1 in