14-3518 Series

Catalog

CONN IC DIP SOCKET 14POS GOLD

Part	Termination Post Length	Material Flammability Rating	Current Rating	Contact Finish Thickness - Mating	Termination	Features	Contact Finish - Post	Housing Material	Contact Finish Thickness - Post	Pitch - Post	Number of Positions or Pins (Grid)	Grid Columns	Grid Rows	Row Spacing	Type	Pitch - Mating	Contact Finish - Mating	Contact Material - Post	Mounting Type	Contact Material - Mating
Aries Electronics 14-3518-10T	0.125 in	UL94 V-0	3 A	10 µin	Solder	Open Frame	Tin	Glass Filled Nylon 4/6 PA46 Polyamide	200 µin	0.1 in	14	7	2	0.3 in	0.3" (7.62mm) Row Spacing DIP	0.1 in	Gold	Brass	Through Hole	Beryllium Copper
Aries Electronics 14-3518-112	0.125 in	UL94 V-0	3 A	10 µin	Solder	Open Frame	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	10 µin	0.1 in	14	7	2	0.3 in	0.3" (7.62mm) Row Spacing DIP	0.1 in	Gold	Brass	Through Hole	Beryllium Copper
Aries Electronics 14-3518-10	0.125 in	UL94 V-0	3 A	10 µin	Solder	Open Frame	Tin	Glass Filled Nylon 4/6 PA46 Polyamide	200 µin	0.1 in	14	7	2	0.3 in	0.3" (7.62mm) Row Spacing DIP	0.1 in	Gold	Brass	Through Hole	Beryllium Copper
Aries Electronics 14-3518-101	0.125 in	UL94 V-0	3 A	10 µin	Solder	Open Frame	Tin	Glass Filled Nylon 4/6 PA46 Polyamide	200 µin	0.1 in	14	7	2	0.3 in	0.3" (7.62mm) Row Spacing DIP	0.1 in	Gold	Brass	Through Hole	Beryllium Copper
Aries Electronics 14-3518-111	0.125 in	UL94 V-0	3 A	10 µin	Solder	Open Frame	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	10 µin	0.1 in	14	7	2	0.3 in	0.3" (7.62mm) Row Spacing DIP	0.1 in	Gold	Brass	Through Hole	Beryllium Copper
Aries Electronics 14-3518-01	0.125 in	UL94 V-0	3 A	10 µin	Solder	Open Frame	Tin	Glass Filled Nylon 4/6 PA46 Polyamide	200 µin	0.1 in	14	7	2	0.3 in	0.3" (7.62mm) Row Spacing DIP	0.1 in	Gold	Brass	Through Hole	Beryllium Copper
Aries Electronics 14-3518-00	0.125 in	UL94 V-0	3 A	10 µin	Solder	Open Frame	Tin	Glass Filled Nylon 4/6 PA46 Polyamide	200 µin	0.1 in	14	7	2	0.3 in	0.3" (7.62mm) Row Spacing DIP	0.1 in	Gold	Brass	Surface Mount	Beryllium Copper
Aries Electronics 14-3518-101H	0.125 in	UL94 V-0	3 A	10 µin	Solder	Open Frame	Tin	Glass Filled Nylon 4/6 PA46 Polyamide	200 µin	0.1 in	14	7	2	0.3 in	0.3" (7.62mm) Row Spacing DIP	0.1 in	Gold	Brass	Through Hole	Beryllium Copper
Aries Electronics 14-3518-102	0.125 in	UL94 V-0	3 A	10 µin	Solder	Open Frame	Tin	Glass Filled Nylon 4/6 PA46 Polyamide	200 µin	0.1 in	14	7	2	0.3 in	0.3" (7.62mm) Row Spacing DIP	0.1 in	Gold	Brass	Through Hole	Beryllium Copper
Aries Electronics 14-3518-10M	0.125 in	UL94 V-0	3 A	10 µin	Solder	Open Frame	Tin	Glass Filled Nylon 4/6 PA46 Polyamide	200 µin	0.1 in	14	7	2	0.3 in	0.3" (7.62mm) Row Spacing DIP	0.1 in	Gold	Brass	Through Hole	Beryllium Copper