CONN PCI EXP FMALE 98POS 0.039
| Part | Gender | Read Out | Card Thickness | Card Thickness | Contact Finish | Features | Contact Material | Number of Rows | Mounting Type | Operating Temperature [Min] | Operating Temperature [Max] | Material - Insulation | Number of Positions | Card Type | Termination | Color | Pitch [x] | Pitch [x] | Contact Finish Thickness | Contact Finish Thickness |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Female | Dual | 0.062 in | 1.57 mm | Gold | Locking Ramp | Phosphor Bronze | 2 | Board Edge Straddle Mount | -55 °C | 125 °C | Liquid Crystal Polymer (LCP) | 98 | PCI Express™ | Solder | Black | 0.039 in | 1 mm | 0.76 Ám | 30 Áin |
Samtec Inc. | Female | Dual | 0.062 in | 1.57 mm | Gold | Board Guide | Phosphor Bronze | 2 | Through Hole Right Angle | -55 °C | 125 °C | Liquid Crystal Polymer (LCP) | 98 | PCI Express™ | Solder Staggered | Black | 0.039 in | 1 mm | 0.076 Ám | 3 Áin |
Samtec Inc. | Female | Dual | 0.062 in | 1.57 mm | Gold | Locking Ramp | Phosphor Bronze | 2 | Board Edge Straddle Mount | -55 °C | 125 °C | Liquid Crystal Polymer (LCP) | 98 | PCI Express™ | Solder | Black | 0.039 in | 1 mm | 0.076 Ám | 3 Áin |
Samtec Inc. | Female | Dual | 0.062 in | 1.57 mm | Gold | Board Guide | Phosphor Bronze | 2 | Through Hole | -55 °C | 125 °C | Liquid Crystal Polymer (LCP) | 98 | PCI Express™ | Solder Staggered | Black | 0.039 in | 1 mm | 0.076 Ám | 3 Áin |
Samtec Inc. | Female | Dual | 0.062 in | 1.57 mm | Gold | Board Guide | Phosphor Bronze | 2 | Board Edge Straddle Mount | -55 °C | 125 °C | Liquid Crystal Polymer (LCP) | 98 | PCI Express™ | Solder | Black | 0.039 in | 1 mm | 0.076 Ám | 3 Áin |