CONN EDGE DUAL FML 120POS 0.031
| Part | Card Type | Read Out | Termination | Material - Insulation | Operating Temperature [Min] | Operating Temperature [Max] | Number of Positions/Bay/Row [custom] | Gender | Number of Rows | Card Thickness | Card Thickness | Contact Finish Thickness | Contact Finish Thickness | Features | Contact Material | Contact Type | Color | Pitch [x] | Pitch [x] | Contact Finish | Number of Positions | Mounting Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Non Specified - Dual Edge | Dual | Solder | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | 60 | Female | 2 | 0.093 in | 2.36 mm | 0.76 Ám | 30 Áin | Board Guide | Beryllium Copper | Cantilever | Black | 0.8 mm | 0.031 in | Gold | 120 | Surface Mount |
Samtec Inc. | Non Specified - Dual Edge | Dual | Solder | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | 60 | Female | 2 | 0.062 in | 1.57 mm | 0.25 Ám | 10 Áin | Card Guides | Beryllium Copper | Cantilever | Black | 0.8 mm | 0.031 in | Gold | 120 | Surface Mount |
Samtec Inc. | Non Specified - Dual Edge | Dual | Solder | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | 60 | Female | 2 | 0.062 in | 1.57 mm | 0.76 Ám | 30 Áin | Board Guide Locking Ramp | Beryllium Copper | Cantilever | Black | 0.8 mm | 0.031 in | Gold | 120 | Surface Mount |
Samtec Inc. | Non Specified - Dual Edge | Dual | Solder | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | 60 | Female | 2 | 0.062 in | 1.57 mm | 0.76 Ám | 30 Áin | Beryllium Copper | Cantilever | Black | 0.8 mm | 0.031 in | Gold | 120 | Surface Mount Right Angle | |
Samtec Inc. | Non Specified - Dual Edge | Dual | Solder | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | 60 | Female | 2 | 0.062 in | 1.57 mm | 0.25 Ám | 10 Áin | Board Guide | Beryllium Copper | Cantilever | Black | 0.8 mm | 0.031 in | Gold | 120 | Surface Mount |
Samtec Inc. | Non Specified - Dual Edge | Dual | Solder | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | 60 | Female | 2 | 0.062 in | 1.57 mm | 0.76 Ám | 30 Áin | Beryllium Copper | Cantilever | Black | 0.8 mm | 0.031 in | Gold | 120 | Surface Mount | |
Samtec Inc. | Non Specified - Dual Edge | Dual | Solder | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | 60 | Female | 2 | 0.062 in | 1.57 mm | 0.76 Ám | 30 Áin | Board Guide | Beryllium Copper | Cantilever | Black | 0.8 mm | 0.031 in | Gold | 120 | Surface Mount |
Samtec Inc. | Non Specified - Dual Edge | Dual | Solder | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | 60 | Female | 2 | 0.062 in | 1.57 mm | 0.25 Ám | 10 Áin | Board Guide Solder Retention | Beryllium Copper | Cantilever | Black | 0.8 mm | 0.031 in | Gold | 120 | Surface Mount |
Samtec Inc. | Non Specified - Dual Edge | Dual | Solder | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | 60 | Female | 2 | 0.062 in | 1.57 mm | 0.25 Ám | 10 Áin | Board Guide Card Guide | Beryllium Copper | Cantilever | Black | 0.8 mm | 0.031 in | Gold | 120 | Surface Mount |
Samtec Inc. | Non Specified - Dual Edge | Dual | Solder | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | 60 | Female | 2 | 0.093 in | 2.36 mm | 0.76 Ám | 30 Áin | Board Guide | Beryllium Copper | Cantilever | Black | 0.8 mm | 0.031 in | Gold | 120 | Surface Mount |