IC CLK BUFFER 1:3 2GHZ 16MLF
| Part | Voltage - Supply [Min] | Voltage - Supply [Max] | Ratio - Input:Output [custom] | Number of Circuits | Package / Case | Type | Output | Input | Frequency - Max [Max] | Operating Temperature [Max] | Operating Temperature [Min] | Differential - Input:Output [custom] | Differential - Input:Output [custom] | Mounting Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology SY89872UMI | 2.375 V | 2.625 V | 1:3 | 1 | 16-MLF®, 16-VFQFN Exposed Pad | Divider, Fanout Buffer (Distribution) | LVDS | CML, HSTL, LVDS, LVPECL | 2 GHz | 85 °C | -40 °C | Surface Mount | ||
Microchip Technology SY89872UMG | ||||||||||||||
Microchip Technology SY89872UMG | ||||||||||||||
Microchip Technology SY89872UMG | 2.375 V | 2.625 V | 1:3 | 1 | 16-MLF®, 16-VFQFN Exposed Pad | Divider, Fanout Buffer (Distribution) | LVDS | CML, HSTL, LVDS, LVPECL | 2 GHz | 85 °C | -40 °C | Surface Mount | ||
Microchip Technology SY89872UMI-TR | 2.375 V | 2.625 V | 1:3 | 1 | 16-MLF®, 16-VFQFN Exposed Pad | Divider, Fanout Buffer (Distribution) | LVDS | CML, HSTL, LVDS, LVPECL | 2 GHz | 85 °C | -40 °C | Surface Mount |