TPA311 Series
350-mW, mono, Class-AB audio amplifier with bridge tied load to single-ended switching mode
Manufacturer: Texas Instruments
Catalog(2 parts)
| Part | Output Type | Package / Case▲▼ | Package / Case | Voltage - Supply▲▼ | Voltage - Supply▲▼ | Operating Temperature▲▼ | Operating Temperature▲▼ | Type | Supplier Device Package | Max Output Power x Channels @ Load▲▼ | Max Output Power x Channels @ Load▲▼ | Features | Mounting Type | Package / Case▲▼ | Package / Case▲▼ |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
1-Channel (Mono) | 0.003899999894201755 m | 8-SOIC | 2.5 V | 5.5 V | 85 °C | -40 °C | Class AB | 8-SOIC | 0.699999988079071 W | 1 ul | Depop, Short-Circuit, Shutdown, Thermal Protection | Surface Mount | |||
1-Channel (Mono) | 8-MSOP, 8-TSSOP, Exposed Pad | 2.5 V | 5.5 V | 85 °C | -40 °C | Class AB | 8-HVSSOP | 0.699999988079071 W | 1 ul | Depop, Short-Circuit, Shutdown, Thermal Protection | Surface Mount | 0.0029972000047564507 m | 0.003000000026077032 m |
Key Features
• Fully Specified for 3.3-V and 5-V OperationWide Power Supply Compatibility 2.5 V - 5.5 VOutput Power for RL= 8350 mW at VDD= 5 V, BTL250 mW at VDD= 5 V, SE250 mW at VDD= 3.3 V, BTL75 mW at VDD= 3.3 V, SEShutdown ControlIDD= 7 µA at 3.3 VIDD= 60 µA at 5 VBTL to SE Mode ControlIntegrated Depop CircuitryThermal and Short-Circuit ProtectionSurface Mount PackagingSOICPowerPADTMMSOPPowerPAD is a trademark of Texas Instruments Incorporated.Fully Specified for 3.3-V and 5-V OperationWide Power Supply Compatibility 2.5 V - 5.5 VOutput Power for RL= 8350 mW at VDD= 5 V, BTL250 mW at VDD= 5 V, SE250 mW at VDD= 3.3 V, BTL75 mW at VDD= 3.3 V, SEShutdown ControlIDD= 7 µA at 3.3 VIDD= 60 µA at 5 VBTL to SE Mode ControlIntegrated Depop CircuitryThermal and Short-Circuit ProtectionSurface Mount PackagingSOICPowerPADTMMSOPPowerPAD is a trademark of Texas Instruments Incorporated.
Description
AI
The TPA311 is a bridge-tied load (BTL) or single-ended (SE) audio power amplifier developed especially for low-voltage applications where internal speakers and external earphone operation are required. Operating with a 3.3-V supply, the TPA311 can deliver 250-mW of continuous power into a BTL 8-load at less than 1% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as cellular communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. A unique feature of the TPA311 is that it allows the amplifier to switch from BTL to SEon the flywhen an earphone drive is required. This eliminates complicated mechanical switching or auxiliary devices just to drive the external load. This device features a shutdown mode for power-sensitive applications with special depop circuitry to virtually eliminate speaker noise when exiting shutdown mode and during power cycling. The TPA311 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%.
The TPA311 is a bridge-tied load (BTL) or single-ended (SE) audio power amplifier developed especially for low-voltage applications where internal speakers and external earphone operation are required. Operating with a 3.3-V supply, the TPA311 can deliver 250-mW of continuous power into a BTL 8-load at less than 1% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as cellular communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. A unique feature of the TPA311 is that it allows the amplifier to switch from BTL to SEon the flywhen an earphone drive is required. This eliminates complicated mechanical switching or auxiliary devices just to drive the external load. This device features a shutdown mode for power-sensitive applications with special depop circuitry to virtually eliminate speaker noise when exiting shutdown mode and during power cycling. The TPA311 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%.