Catalog(2 parts)
| Part | Number of Bits per Element▲▼ | Operating Temperature▲▼ | Operating Temperature▲▼ | Supplier Device Package | Output Type | Voltage - Supply▲▼ | Voltage - Supply▲▼ | Package / Case▲▼ | Package / Case▲▼ | Package / Case | Mounting Type | Current - Output High, Low▲▼ | Current - Output High, Low▲▼ | Number of Elements▲▼ | Package / Case▲▼ | Package / Case▲▼ |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments 74ACT16543DLRTransceiver, Non-Inverting 2 Element 8 Bit per Element 3-State Output 56-SSOP | 8 ul | 85 °C | -40 °C | 56-SSOP | 3-State | 5.5 V | 4.5 V | 0.007493000011891127 m | 0.007499999832361937 m | 56-BSSOP | Surface Mount | 0.024000000208616257 A | 0.024000000208616257 A | 2 ul | ||
Texas Instruments 74ACT16543DGGRTransceiver, Non-Inverting 2 Element 8 Bit per Element 3-State Output 56-TSSOP | 8 ul | 85 °C | -40 °C | 56-TSSOP | 3-State | 5.5 V | 4.5 V | 56-TFSOP | Surface Mount | 0.024000000208616257 A | 0.024000000208616257 A | 2 ul | 0.006099999882280827 m | 0.006095999851822853 m |
Key Features
• Members of the Texas Instruments WidebusTMFamilyInputs Are TTL-Voltage Compatible3-State True OutputsFlow-Through Architecture Optimizes PCB LayoutDistributed VCCand GND Pin Configurations Minimize High-Speed Switching NoiseEPICTM(Enhanced-Performance Implanted CMOS) 1-m Process500-mA Typical Latch-Up Immunity at 125°CPackage Options Include Plastic Thin Shrink Small-Outline (DGG) and 300-mil Shrink Small-Outline (DL) Packages Using 25-mil Center-to-Center Pin Spacings, and 380-mil Fine-Pitch Ceramic Flat (WD) Packages Using 25-mil Center-to-Center Pin SpacingsEPIC and Widebus are trademarks of Texas Instruments Incorporated.Members of the Texas Instruments WidebusTMFamilyInputs Are TTL-Voltage Compatible3-State True OutputsFlow-Through Architecture Optimizes PCB LayoutDistributed VCCand GND Pin Configurations Minimize High-Speed Switching NoiseEPICTM(Enhanced-Performance Implanted CMOS) 1-m Process500-mA Typical Latch-Up Immunity at 125°CPackage Options Include Plastic Thin Shrink Small-Outline (DGG) and 300-mil Shrink Small-Outline (DL) Packages Using 25-mil Center-to-Center Pin Spacings, and 380-mil Fine-Pitch Ceramic Flat (WD) Packages Using 25-mil Center-to-Center Pin SpacingsEPIC and Widebus are trademarks of Texas Instruments Incorporated.
Description
AI
The 'ACT16543 are 16-bit registered transceivers that contain two sets of D-type latches for temporary storage of data flowing in either direction. The 'ACT16543 can be used as two 8-bit transceivers or one 16-bit transceiver. Separate latch enable (or) and output-enable (or) inputs are provided for each register to permit independent control in either direction of data flow.
The A-to-B enable () andinputs must be low to enter data from A or to output data to B. Having CEAB\ low and LEAB\ low makes the A-to-B latches transparent; a subsequent low-to-high transition atputs the A latches in the storage mode. Data flow from B to A is similar, but requires using the,, andinputs.
The 74ACT16543 is packaged in TI's shrink small-outline package, which provides twice the functionality of standard small-outline packages in the same printed-circuit-board area.
The 54ACT16543 is characterized for operation over the full military temperature range of -55°C to 125°C. The 74ACT16543 is characterized for operation from -40°C to 85°C.
The 'ACT16543 are 16-bit registered transceivers that contain two sets of D-type latches for temporary storage of data flowing in either direction. The 'ACT16543 can be used as two 8-bit transceivers or one 16-bit transceiver. Separate latch enable (or) and output-enable (or) inputs are provided for each register to permit independent control in either direction of data flow.
The A-to-B enable () andinputs must be low to enter data from A or to output data to B. Having CEAB\ low and LEAB\ low makes the A-to-B latches transparent; a subsequent low-to-high transition atputs the A latches in the storage mode. Data flow from B to A is similar, but requires using the,, andinputs.
The 74ACT16543 is packaged in TI's shrink small-outline package, which provides twice the functionality of standard small-outline packages in the same printed-circuit-board area.
The 54ACT16543 is characterized for operation over the full military temperature range of -55°C to 125°C. The 74ACT16543 is characterized for operation from -40°C to 85°C.