CSD96415 Series

80-A peak continuous current synchronous buck NexFET™ power stage

Catalog

80-A peak continuous current synchronous buck NexFET™ power stage

Part	Current - Peak Output	Fault Protection	Voltage - Supply	Features	Mounting Type	Applications	Operating Temperature (Max)	Operating Temperature (Min)	Technology	Interface	Package / Case	Voltage - Load	Load Type	Package Name	Package Length	Package Width
Texas Instruments CSD96415RWJT	80 A	Shoot-Through	16 V	Bootstrap Circuit	Surface Mount	Synchronous Buck Converters	150 °C	-55 °C	Power MOSFET	PWM	41-PowerTFQFN	25 V	Inductive	41-VQFN-CLIP	5 mm	6 mm
Texas Instruments CSD96415RWJ	80 A	Shoot-Through	16 V	Bootstrap Circuit	Surface Mount	Synchronous Buck Converters	150 °C	-55 °C	Power MOSFET	PWM	41-PowerTFQFN	25 V	Inductive	41-VQFN-CLIP	5 mm	6 mm

Catalog

80-A peak continuous current synchronous buck NexFET™ power stage

Description

The CSD96415RWJ NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver device and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5 mm × 6 mm package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design. The CSD96415RWJ NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver device and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5 mm × 6 mm package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.