TLW-136 Series
Manufacturer: Samtec Inc.
LOW PROFILE .025 SQ STRIPS
| Part | Mounting Type | Termination | Insulation Height | Contact Shape | Operating Temperature (Max) | Operating Temperature (Min) | Contact Finish - Mating | Contact Type | Contact Length - Post | Fastening Type | Row Spacing - Mating | Overall Contact Length | Insulation Color | Pitch - Mating | Contact Material | Shrouding | Style | Insulation Material | Number of Positions | Connector Type | Number of Rows | Contact Length - Mating | Current Rating (Per Contact) | Number of Positions Loaded | Contact Finish - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post (string_set) | Number of Positions Loaded |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Through Hole | Solder | 0.06 in | Square | 125 °C | -55 °C | Gold | Male Pin | 0.135 in | Push-Pull | 0.1 in | 0.3 in | Black | 0.1 in | Phosphor Bronze | Unshrouded | Board Board or Cable | Liquid Crystal Polymer (LCP) | 72 | Header | 2 | 0.105 in | 5.2 A | All | |||||
Samtec Inc. | Through Hole | Solder | 0.06 in | Square | 105 °C | -55 °C | Tin | Male Pin | 0.135 in | Push-Pull | 0.1 in | 0.3 in | Black | 0.1 in | Phosphor Bronze | Unshrouded | Board Board or Cable | Liquid Crystal Polymer (LCP) | 72 | Header | 2 | 0.105 in | 5.2 A | All | Tin | ||||
Samtec Inc. | Right Angle Through Hole | Solder | 0.197 in | Square | 105 °C | -55 °C | Tin | Male Pin | 0.12 in | Push-Pull | 0.1 in | Black | 0.1 in | Phosphor Bronze | Unshrouded | Board Board or Cable | Liquid Crystal Polymer (LCP) | 72 | Header | 2 | 0.23 in | 5.2 A | All | Tin | |||||
Samtec Inc. | Through Hole | Solder | 0.06 in | Square | 125 °C | -55 °C | Gold | Male Pin | 0.135 in | Push-Pull | 0.1 in | 0.3 in | Black | 0.1 in | Phosphor Bronze | Unshrouded | Board Board or Cable | Liquid Crystal Polymer (LCP) | 72 | Header | 2 | 0.105 in | 5.2 A | All | Tin | 3 µin | |||
Samtec Inc. | Through Hole | Solder | 0.06 in | Square | 125 °C | -55 °C | Gold | Male Pin | 0.17 in | Push-Pull | 0.1 in | 0.335 in | Black | 0.1 in | Phosphor Bronze | Unshrouded | Board Board or Cable | Liquid Crystal Polymer (LCP) | 72 | Header | 2 | 0.105 in | 5.2 A | All | Gold | 10 µin | Flash | Flash | |
Samtec Inc. | Through Hole | Solder | 0.06 in | Square | 125 °C | -55 °C | Gold | Male Pin | 0.135 in | Push-Pull | 0.3 in | Black | 0.1 in | Phosphor Bronze | Unshrouded | Board Board or Cable | Liquid Crystal Polymer (LCP) | 36 | Header | 1 | 0.105 in | 5.2 A | All | Gold | 10 µin | Flash | Flash | ||
Samtec Inc. | Through Hole | Solder | 0.06 in | Square | 125 °C | -55 °C | Gold | Male Pin | 0.135 in | Push-Pull | 0.3 in | Black | 0.1 in | Phosphor Bronze | Unshrouded | Board Board or Cable | Liquid Crystal Polymer (LCP) | 36 | Header | 1 | 0.105 in | 5.2 A | All | Tin | 3 µin | ||||
Samtec Inc. | Through Hole | Solder | 0.06 in | Square | 125 °C | -55 °C | Gold | Male Pin | 0.17 in | Push-Pull | 0.335 in | Black | 0.1 in | Phosphor Bronze | Unshrouded | Board Board or Cable | Liquid Crystal Polymer (LCP) | 36 | Header | 1 | 0.105 in | 5.2 A | Gold | 10 µin | Flash | Flash | 35 | ||
Samtec Inc. | Through Hole | Solder | 0.06 in | Square | 105 °C | -55 °C | Tin | Male Pin | 0.17 in | Push-Pull | 0.335 in | Black | 0.1 in | Phosphor Bronze | Unshrouded | Board Board or Cable | Liquid Crystal Polymer (LCP) | 36 | Header | 1 | 0.105 in | 5.2 A | All | Tin | |||||
Samtec Inc. | Right Angle Through Hole | Solder | 0.197 in | Square | 125 °C | -55 °C | Gold | Male Pin | 0.12 in | Push-Pull | 0.1 in | Black | 0.1 in | Phosphor Bronze | Unshrouded | Board Board or Cable | Liquid Crystal Polymer (LCP) | 72 | Header | 2 | 0.23 in | 5.2 A | All | Gold | 10 µin | Flash | Flash |