TLV3501A-Q1 Series
Automotive-grade, high-speed, single rail-to-rail comparator with shutdown function
Manufacturer: Texas Instruments
Link to Manufacturer Page: https://www.ti.com/
Catalog
Automotive-grade, high-speed, single rail-to-rail comparator with shutdown function
| Part | Type | Current - Quiescent (Max) [Max] | Output Type | Operating Temperature [Max] | Operating Temperature [Min] | Voltage - Input Offset (Max) | Mounting Type | Number of Elements [custom] | Supplier Device Package | Hysteresis | Current - Input Bias (Max) | CMRR, PSRR (Typ) | Qualification | Grade | Voltage - Supply, Single/Dual (±) [Max] | Voltage - Supply, Single/Dual (±) [Min] | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments TLV3501AQDBVRQ1 | General Purpose | 5 mA | CMOS, Push-Pull, Rail-to-Rail, TTL | 125 °C | -40 °C | 6.5 mV | Surface Mount | 1 | SOT-23-6 | 6 mV | 10 pA | 70 dB, 100 dB | AEC-Q100 | Automotive | 2.75 V, 5.5 V | -1.35 V, 2.7 V | SOT-23-6 |
Texas Instruments TLV3501AZQDBVRQ1 | General Purpose | 5 mA | CMOS, Push-Pull, Rail-to-Rail, TTL | 125 °C | -40 °C | 6.5 mV | Surface Mount | 1 | SOT-23-6 | 6 mV | 10 pA | 70 dB, 100 dB | AEC-Q100 | Automotive | 2.75 V, 5.5 V | -1.35 V, 2.7 V | SOT-23-6 |
Key Features
• Qualified for Automotive ApplicationsAEC-Q100 Qualified With the Following Results:Device Temperature Grade 1: –40°C to+125°C Ambient Operating Temperature RangeDevice HBM Classification Level 2Device CDM Classification Level C4BHigh Speed: 4.5 nsRail-To-Rail I/OSupply Voltage: 2.7 V to 5.5 VPush-Pull CMOS Output StageShutdownMicro Package: SOT23-6Low Supply Current: 3.2 mAZ-Suffix Offers Improved DelaminationAPPLICATIONSHEV/EV and Powertrain ApplicationsDC-DC ConverterInverterFuel SensingHybrid Power Control UnitAutomatic Test EquipmentThreshold DetectorZero-Crossing DetectorWindow ComparatorAll other trademarks are the property of their respective ownersQualified for Automotive ApplicationsAEC-Q100 Qualified With the Following Results:Device Temperature Grade 1: –40°C to+125°C Ambient Operating Temperature RangeDevice HBM Classification Level 2Device CDM Classification Level C4BHigh Speed: 4.5 nsRail-To-Rail I/OSupply Voltage: 2.7 V to 5.5 VPush-Pull CMOS Output StageShutdownMicro Package: SOT23-6Low Supply Current: 3.2 mAZ-Suffix Offers Improved DelaminationAPPLICATIONSHEV/EV and Powertrain ApplicationsDC-DC ConverterInverterFuel SensingHybrid Power Control UnitAutomatic Test EquipmentThreshold DetectorZero-Crossing DetectorWindow ComparatorAll other trademarks are the property of their respective owners
Description
AI
The TLV3501A-Q1 push-pull output comparator features a fast 4.5-ns propagation delay and operation from 2.7 V to 5.5 V. The input voltage supports a common-mode range that goes beyond the rails which makes the device an ideal choice for low-voltage applications. The rail-to-rail output directly drives either CMOS or TTL logic. The fast delay and wide common-mode range also makes TLV3501A-Q1 device ideal for EMI reduction through frequency dithering by lowering the EMI peaks. These parameters allow the device to be ideal for both DC-DC converter and inverter applications in HEV/EV and powertrain.
The SOT23-6 microsized package provides options for portable and space-restricted applications. The Z-suffix offers reduced delamination compared to the standard device.
The TLV3501A-Q1 push-pull output comparator features a fast 4.5-ns propagation delay and operation from 2.7 V to 5.5 V. The input voltage supports a common-mode range that goes beyond the rails which makes the device an ideal choice for low-voltage applications. The rail-to-rail output directly drives either CMOS or TTL logic. The fast delay and wide common-mode range also makes TLV3501A-Q1 device ideal for EMI reduction through frequency dithering by lowering the EMI peaks. These parameters allow the device to be ideal for both DC-DC converter and inverter applications in HEV/EV and powertrain.
The SOT23-6 microsized package provides options for portable and space-restricted applications. The Z-suffix offers reduced delamination compared to the standard device.