10-2810 Series

Catalog

CONN IC DIP SOCKET 10POS GOLD

Part	Contact Finish Thickness - Post	Mounting Type	Housing Material	Features	Grid Columns	Grid Rows	Number of Positions or Pins (Grid)	Contact Finish - Post	Contact Finish Thickness - Mating	Contact Finish - Mating	Row Spacing	Type	Pitch - Mating	Pitch - Post	Contact Material - Mating	Termination	Contact Material - Post	Termination Post Length	Material Flammability Rating	Current Rating
Aries Electronics 10-2810-90C	200 µin	Right Angle Through Hole Vertical	Glass Filled Nylon 4/6 PA46 Polyamide	Closed Frame	5	2	10	Tin	30 µin	Gold	0.2 in	0.2" (5.08mm) Row Spacing DIP	0.1 in	0.1 in	Beryllium Copper	Solder	Brass	0.14 in	UL94 V-0	3 A
Aries Electronics 10-2810-90	10 µin	Right Angle Through Hole Vertical	Nylon 4/6 PA46 Polyamide	Closed Frame	5	2	10	Gold	10 µin	Gold	0.2 in	0.2" (5.08mm) Row Spacing DIP	0.1 in	0.1 in	Phosphor Bronze	Solder	Phosphor Bronze	0.145 in	UL94 V-0	1.5 A