TLW-112 Series

Catalog

LOW PROFILE .025 SQ STRIPS

Part	Current Rating (Per Contact)	Shrouding	Number of Positions	Insulation Height	Contact Length - Mating	Number of Rows	Fastening Type	Termination	Connector Type	Mounting Type	Row Spacing - Mating	Insulation Color	Contact Type	Contact Shape	Contact Length - Post	Contact Material	Contact Finish - Mating	Insulation Material	Style	Operating Temperature (Max)	Operating Temperature (Min)	Overall Contact Length	Number of Positions Loaded	Pitch - Mating	Contact Finish - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post (string_set)	Number of Positions Loaded
Samtec Inc. TLW-112-06-L-D	5.2 A	Unshrouded	24 pos	0.06 in	0.105 in	2	Push-Pull	Solder	Header	Through Hole	0.1 in	Black	Male Pin	Square	0.135 in	Phosphor Bronze	Gold	Liquid Crystal Polymer (LCP)	Board Board or Cable	125 °C	-55 °C	0.3 in	All	0.1 in
Samtec Inc. TLW-112-05-S-D	5.2 A	Unshrouded	24 pos	0.06 in	0.105 in	2	Push-Pull	Solder	Header	Through Hole	0.1 in	Black	Male Pin	Square	0.17 in	Phosphor Bronze	Gold	Liquid Crystal Polymer (LCP)	Board Board or Cable	125 °C	-55 °C	0.335 in	All	0.1 in
Samtec Inc. TLW-112-05-T-D	5.2 A	Unshrouded	24 pos	0.06 in	0.105 in	2	Push-Pull	Solder	Header	Through Hole	0.1 in	Black	Male Pin	Square	0.17 in	Phosphor Bronze	Tin	Liquid Crystal Polymer (LCP)	Board Board or Cable	105 °C	-55 °C	0.335 in	All	0.1 in	Tin
Samtec Inc. TLW-112-06-G-S	5.2 A	Unshrouded	12	0.06 in	0.105 in	1	Push-Pull	Solder	Header	Through Hole		Black	Male Pin	Square	0.135 in	Phosphor Bronze	Gold	Liquid Crystal Polymer (LCP)	Board Board or Cable	125 °C	-55 °C	0.3 in	All	0.1 in	Gold	10 µin	Flash	Flash
Samtec Inc. TLW-112-06-F-S-LL	5.2 A	Unshrouded	12	0.06 in	0.105 in	1	Push-Pull	Solder	Header	Through Hole		Black	Male Pin	Square	0.135 in	Phosphor Bronze	Gold	Liquid Crystal Polymer (LCP)	Board Board or Cable	125 °C	-55 °C	0.3 in	All	0.1 in	Tin	3 µin
Samtec Inc. TLW-112-01-H-S-LA	5.2 A	Unshrouded	12	0.098 in	0.23 in	1	Push-Pull	Solder	Header	Right Angle Through Hole		Black	Male Pin	Square	0.12 in	Phosphor Bronze	Gold	Liquid Crystal Polymer (LCP)	Board Board or Cable	125 °C	-55 °C		All	0.1 in
Samtec Inc. TLW-112-06-T-S-01	5.2 A	Unshrouded	12	0.06 in	0.105 in	1	Push-Pull	Solder	Header	Through Hole		Black	Male Pin	Square	0.135 in	Phosphor Bronze	Tin	Liquid Crystal Polymer (LCP)	Board Board or Cable	105 °C	-55 °C	0.3 in		0.1 in	Tin				11
Samtec Inc. TLW-112-06-G-D	5.2 A	Unshrouded	24 pos	0.06 in	0.105 in	2	Push-Pull	Solder	Header	Through Hole	0.1 in	Black	Male Pin	Square	0.135 in	Phosphor Bronze	Gold	Liquid Crystal Polymer (LCP)	Board Board or Cable	125 °C	-55 °C	0.3 in	All	0.1 in	Gold	10 µin	Flash	Flash
Samtec Inc. TLW-112-06-F-D	5.2 A	Unshrouded	24 pos	0.06 in	0.105 in	2	Push-Pull	Solder	Header	Through Hole	0.1 in	Black	Male Pin	Square	0.135 in	Phosphor Bronze	Gold	Liquid Crystal Polymer (LCP)	Board Board or Cable	125 °C	-55 °C	0.3 in	All	0.1 in	Tin	3 µin
Samtec Inc. TLW-112-01-TM-D-RA	5.2 A	Unshrouded	24 pos	0.197 in	0.23 in	2	Push-Pull	Solder	Header	Right Angle Through Hole	0.1 in	Black	Male Pin	Square	0.12 in	Phosphor Bronze	Tin	Liquid Crystal Polymer (LCP)	Board Board or Cable	105 °C	-55 °C		All	0.1 in	Tin