IC FLSH 256GBIT EMMC 5.1 153FBGA
| Part | Technology | Memory Interface | Supplier Device Package [x] | Supplier Device Package | Supplier Device Package [y] | Memory Organization | Package / Case | Memory Format | Operating Temperature [Max] | Operating Temperature [Min] | Mounting Type | Memory Size | Clock Frequency | Memory Type | Voltage - Supply [Min] | Voltage - Supply [Max] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Flexxon Pte Ltd FEMC032GBA-T740 | FLASH - NAND (TLC) | eMMC_5.1 | 11.5 | 153-FBGA | 13 | 32 G | 153-VFBGA | FLASH | 85 °C | -40 °C | Surface Mount | 256 Gbit | 200 MHz | Non-Volatile | 2.7 V | 3.6 V |
Flexxon Pte Ltd FEMC032GBE-T740 | FLASH - NAND (TLC) | eMMC_5.1 | 11.5 | 153-FBGA | 13 | 32 G | 153-VFBGA | FLASH | 85 °C | -40 °C | Surface Mount | 256 Gbit | 200 MHz | Non-Volatile | 2.7 V | 3.6 V |
Flexxon Pte Ltd FEMC032GCG-T340 | FLASH - NAND (pSLC) | eMMC | 11.5 | 153-FBGA | 13 | 32 G | 153-VFBGA | FLASH | 85 °C | -25 °C | Surface Mount | 256 Gbit | 200 MHz | Non-Volatile | 2.7 V | 3.6 V |
Flexxon Pte Ltd FEMC032G-M10 | FLASH - NAND (TLC) | eMMC_5.1 | 11.5 | 153-FBGA | 13 | 32 G | 153-VFBGA | FLASH | 85 °C | -25 °C | Surface Mount | 256 Gbit | 200 MHz | Non-Volatile | 2.7 V | 3.6 V |
Flexxon Pte Ltd FEMC032GBE-TC40 | FLASH - NAND (TLC) | eMMC | 11.5 | 153-FBGA | 13 | 32 G | 153-VFBGA | FLASH | 85 °C | -40 °C | Surface Mount | 256 Gbit | 200 MHz | Non-Volatile | 2.7 V | 3.6 V |
Flexxon Pte Ltd FEMC032GBB-T740 | FLASH - NAND (TLC) | eMMC_5.1 | 11.5 | 153-FBGA | 13 | 32 G | 153-VFBGA | FLASH | 105 ░C | -40 °C | Surface Mount | 256 Gbit | 200 MHz | Non-Volatile | 2.7 V | 3.6 V |
Flexxon Pte Ltd FEMC032GBG-T340 | FLASH - NAND (TLC) | eMMC | 11.5 | 153-FBGA | 13 | 32 G | 153-VFBGA | FLASH | 85 °C | -25 °C | Surface Mount | 256 Gbit | 200 MHz | Non-Volatile | 2.7 V | 3.6 V |
Flexxon Pte Ltd FEMC032GTTE7-T13-26 | FLASH - NAND (MLC) | eMMC | 32 G | 100-LBGA | FLASH | 85 °C | -40 °C | Surface Mount | 256 Gbit | 200 MHz | Non-Volatile | 2.7 V | 3.6 V |