CONN HEADER SMD R/A 19POS 2.54MM
| Part | Contact Type | Pitch - Mating | Pitch - Mating | Style | Mounting Type | Insulation Height | Insulation Height | Termination | Contact Finish - Post | Features | Shrouding | Contact Material | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Number of Positions Loaded | Insulation Material | Contact Shape | Insulation Color | Number of Positions | Material Flammability Rating | Contact Length - Mating [x] | Contact Length - Mating | Number of Rows | Operating Temperature [Min] | Operating Temperature [Max] | Connector Type | Contact Finish - Mating | Fastening Type | Contact Length - Mating | Row Spacing - Mating [x] | Row Spacing - Mating [x] | Contact Finish Thickness - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Male Pin | 0.1 in | 2.54 mm | Board to Board Cable | Surface Mount Right Angle | 3.05 mm | 0.12 in | Solder | Tin | Board Guide Pick and Place | Unshrouded | Phosphor Bronze | 10 çin | 0.25 çm | All | Liquid Crystal Polymer (LCP) | Square | Black | 19 | UL94 V-0 | 0.23 in | 5.84 mm | 1 | -55 °C | 125 °C | Header | Gold | Push-Pull | |||||
Samtec Inc. | Male Pin | 0.1 in | 2.54 mm | Board to Board Cable | Surface Mount Right Angle | 3.05 mm | 0.12 in | Solder | Tin | Board Guide | Unshrouded | Phosphor Bronze | All | Liquid Crystal Polymer (LCP) | Square | Black | 19 | UL94 V-0 | 3.05 mm | 1 | -55 °C | 105 ░C | Header | Push-Pull | 0.12 in | ||||||||
Samtec Inc. | Male Pin | 0.1 in | 2.54 mm | Board to Board Cable | Surface Mount Right Angle | 3.05 mm | 0.12 in | Solder | Tin | Board Guide Pick and Place | Unshrouded | Phosphor Bronze | 3 µin | 0.076 µm | All | Liquid Crystal Polymer (LCP) | Square | Black | 19 | UL94 V-0 | 10.67 mm | 1 | -55 °C | 125 °C | Header | Gold | Push-Pull | 0.42 in | |||||
Samtec Inc. | Male Pin | 0.1 in | 2.54 mm | Board to Board Cable | Surface Mount | 2.54 mm | 0.1 in | Solder | Gold | Board Guide | Unshrouded | Phosphor Bronze | 10 çin | 0.25 çm | All | Liquid Crystal Polymer (LCP) | Square | Black | 38 | UL94 V-0 | 10.67 mm | 2 | -55 °C | 125 °C | Cuttable Header | Gold | Push-Pull | 0.42 in | 2.54 mm | 0.1 in | 3 µin | 0.076 µm | |
Samtec Inc. | Male Pin | 0.1 in | 2.54 mm | Board to Board Cable | Surface Mount | 2.54 mm | 0.1 in | Solder | Tin | Board Guide | Unshrouded | Phosphor Bronze | 10 çin | 0.25 çm | All | Liquid Crystal Polymer (LCP) | Square | Black | 38 | UL94 V-0 | 0.23 in | 5.84 mm | 2 | -55 °C | 125 °C | Cuttable Header | Gold | Push-Pull | 2.54 mm | 0.1 in | |||
Samtec Inc. | Male Pin | 0.1 in | 2.54 mm | Board to Board Cable | Surface Mount Right Angle | 3.05 mm | 0.12 in | Solder | Tin | Unshrouded | Phosphor Bronze | All | Liquid Crystal Polymer (LCP) | Square | Black | 19 | UL94 V-0 | 8.13 mm | 1 | -55 °C | 105 ░C | Header | Push-Pull | 0.32 in | |||||||||
Samtec Inc. | Male Pin | 0.1 in | 2.54 mm | Board to Board Cable | Surface Mount | 2.54 mm | 0.1 in | Solder | Tin | Pick and Place | Unshrouded | Phosphor Bronze | 30 Áin | 0.76 Ám | All | Liquid Crystal Polymer (LCP) | Square | Black | 38 | UL94 V-0 | 0.23 in | 5.84 mm | 2 | -55 °C | 125 °C | Cuttable Header | Gold | Push-Pull | 2.54 mm | 0.1 in | |||
Samtec Inc. | Male Pin | 0.1 in | 2.54 mm | Board to Board Cable | Surface Mount Right Angle | 3.05 mm | 0.12 in | Solder | Tin | Pick and Place | Unshrouded | Phosphor Bronze | All | Liquid Crystal Polymer (LCP) | Square | Black | 19 | UL94 V-0 | 8.13 mm | 1 | -55 °C | 105 ░C | Header | Push-Pull | 0.32 in | ||||||||
Samtec Inc. | Male Pin | 0.1 in | 2.54 mm | Board to Board Cable | Surface Mount | 2.54 mm | 0.1 in | Solder | Tin | Pick and Place | Unshrouded | Phosphor Bronze | All | Liquid Crystal Polymer (LCP) | Square | Black | 19 | UL94 V-0 | 0.23 in | 5.84 mm | 1 | -55 °C | 105 ░C | Cuttable Header | Push-Pull | ||||||||
Samtec Inc. |