SN74AUP3G04 Series

3-ch, 0.8-V to 3.6-V low power inverters

Catalog

3-ch, 0.8-V to 3.6-V low power inverters

Part	Number of Inputs	Logic Type	Number of Circuits	Operating Temperature (Min)	Operating Temperature (Max)	Package Name	Package Length	Package Width	Input Logic Level - High (Min)	Input Logic Level - High (Max)	Current - Output Low	Current - Output High	Max CL	Max Propagation Delay	Mounting Type	Input Logic Level - Low (Max)	Input Logic Level - Low (Min)	Current - Quiescent (Max)	Voltage - Supply (Minimum)	Voltage - Supply (Maximum)	Package / Case
Texas Instruments SN74AUP3G04DQER	3	Inverter	3	-40 °C	85 °C	8-X2SON	1.4 mm	1 mm	1.6 V	2 V	4 mA	4 mA	30 pF	6.2 ns	Surface Mount	0.9 V	0.7 V	500 nA	0.8 V	3.6 V	8-XFDFN
Texas Instruments SN74AUP3G04RSER	3	Inverter	3	-40 °C	85 °C	8-UQFN	1.5 mm	1.5 mm	1.6 V	2 V	4 mA	4 mA	30 pF	6.2 ns	Surface Mount	0.9 V	0.7 V	500 nA	0.8 V	3.6 V	8-UFQFN
Texas Instruments SN74AUP3G04DCUR	3	Inverter	3	-40 °C	85 °C	8-VFSOP 8-VSSOP	0.091 in	2.3 mm	1.6 V	2 V	4 mA	4 mA	30 pF	6.2 ns	Surface Mount	0.9 V	0.7 V	500 nA	0.8 V	3.6 V
Texas Instruments SN74AUP3G04YFPR	3	Inverter	3	-40 °C	85 °C	8-DSBGA			1.6 V	2 V	4 mA	4 mA	30 pF	6.2 ns	Surface Mount	0.9 V	0.7 V	500 nA	0.8 V	3.6 V	8-XFBGA DSBGA

Catalog

3-ch, 0.8-V to 3.6-V low power inverters

Description

The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCCrange of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2). The SN74AUP3G04 performs the Boolean function Y = A in positive logic. NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCCrange of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2). The SN74AUP3G04 performs the Boolean function Y = A in positive logic. NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.