CONN RCPT 80POS 0.05 GOLD SMD
| Part | Contact Material | Contact Finish - Post | Insulation Height [z] | Insulation Height [z] | Pitch - Mating | Pitch - Mating | Insulation Color | Fastening Type | Material Flammability Rating | Number of Positions Loaded | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination | Mounting Type | Contact Type | Contact Finish - Mating | Current Rating (Amps) | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Operating Temperature [Min] | Operating Temperature [Max] | Contact Shape | Insulation Material | Connector Type | Features | Row Spacing - Mating | Row Spacing - Mating | Number of Positions |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Phosphor Bronze | Gold | 0.16 in | 4.06 mm | 0.05 in | 1.27 mm | Black | Push-Pull | UL94 V-0 | All | 10 çin | 0.25 çm | Solder | Surface Mount | Forked | Gold | 2.4 A | 3 µin | 0.076 µm | -55 °C | 125 °C | Square | Liquid Crystal Polymer (LCP) | Receptacle | Board Guide | 0.05 in | 1.27 mm | 80 |
Samtec Inc. | Phosphor Bronze | Gold | 0.16 in | 4.06 mm | 0.05 in | 1.27 mm | Black | Push-Pull | UL94 V-0 | All | 3 µin | 0.076 µm | Solder | Surface Mount | Forked | Gold | 2.4 A | 3 µin | 0.076 µm | -55 °C | 125 °C | Square | Liquid Crystal Polymer (LCP) | Receptacle | Pick and Place | 0.05 in | 1.27 mm | 80 |
Samtec Inc. | Phosphor Bronze | Gold | 0.16 in | 4.06 mm | 0.05 in | 1.27 mm | Black | Push-Pull | UL94 V-0 | All | 30 Áin | 0.76 Ám | Solder | Surface Mount | Forked | Gold | 2.4 A | 3 µin | 0.076 µm | -55 °C | 125 °C | Square | Liquid Crystal Polymer (LCP) | Receptacle | Pick and Place | 0.05 in | 1.27 mm | 80 |
Samtec Inc. | Phosphor Bronze | Gold | 0.16 in | 4.06 mm | 0.05 in | 1.27 mm | Black | Push-Pull | UL94 V-0 | All | 30 Áin | 0.76 Ám | Solder | Surface Mount | Forked | Gold | 2.4 A | 3 µin | 0.076 µm | -55 °C | 125 °C | Square | Liquid Crystal Polymer (LCP) | Receptacle | Board Guide Pick and Place | 0.05 in | 1.27 mm | 80 |
Samtec Inc. | Phosphor Bronze | Gold | 0.16 in | 4.06 mm | 0.05 in | 1.27 mm | Black | Push-Pull | UL94 V-0 | All | 10 çin | 0.25 çm | Solder | Surface Mount | Forked | Gold | 2.4 A | 3 µin | 0.076 µm | -55 °C | 125 °C | Square | Liquid Crystal Polymer (LCP) | Receptacle | Pick and Place | 0.05 in | 1.27 mm | 80 |
Samtec Inc. | Phosphor Bronze | Gold | 0.16 in | 4.06 mm | 0.05 in | 1.27 mm | Black | Push-Pull | UL94 V-0 | All | 30 Áin | 0.76 Ám | Solder | Surface Mount | Forked | Gold | 2.4 A | 3 µin | 0.076 µm | -55 °C | 125 °C | Square | Liquid Crystal Polymer (LCP) | Receptacle | Board Guide Pick and Place | 0.05 in | 1.27 mm | 80 |
Samtec Inc. | Phosphor Bronze | Gold | 0.16 in | 4.06 mm | 0.05 in | 1.27 mm | Black | Push-Pull | UL94 V-0 | All | 10 çin | 0.25 çm | Solder | Surface Mount | Forked | Gold | 2.4 A | 3 µin | 0.076 µm | -55 °C | 125 °C | Square | Liquid Crystal Polymer (LCP) | Receptacle | Pick and Place | 0.05 in | 1.27 mm | 80 |
Samtec Inc. | Phosphor Bronze | Gold | 0.16 in | 4.06 mm | 0.05 in | 1.27 mm | Black | Push-Pull | UL94 V-0 | All | 10 çin | 0.25 çm | Solder | Surface Mount | Forked | Gold | 2.4 A | 3 µin | 0.076 µm | -55 °C | 125 °C | Square | Liquid Crystal Polymer (LCP) | Receptacle | Board Lock Pick and Place | 0.05 in | 1.27 mm | 80 |
Samtec Inc. | Phosphor Bronze | Gold | 0.16 in | 4.06 mm | 0.05 in | 1.27 mm | Black | Push-Pull | UL94 V-0 | All | 30 Áin | 0.76 Ám | Solder | Surface Mount | Forked | Gold | 2.4 A | 3 µin | 0.076 µm | -55 °C | 125 °C | Square | Liquid Crystal Polymer (LCP) | Receptacle | Board Lock Pick and Place | 0.05 in | 1.27 mm | 80 |
Samtec Inc. | Phosphor Bronze | Gold | 0.16 in | 4.06 mm | 0.05 in | 1.27 mm | Black | Push-Pull | UL94 V-0 | All | 10 çin | 0.25 çm | Solder | Surface Mount | Forked | Gold | 2.4 A | 3 µin | 0.076 µm | -55 °C | 125 °C | Square | Liquid Crystal Polymer (LCP) | Receptacle | Board Guide Pick and Place | 0.05 in | 1.27 mm | 80 |