CONN HEADER SMD 3POS 1.27MM
| Part | Insulation Height | Insulation Height | Contact Type | Insulation Color | Shrouding | Pitch - Mating | Pitch - Mating | Contact Shape | Contact Finish - Post | Insulation Material | Contact Material | Number of Positions Loaded | Current Rating (Amps) | Fastening Type | Connector Type | Operating Temperature [Min] | Operating Temperature [Max] | Termination | Number of Rows | Contact Finish - Mating | Contact Length - Mating | Contact Length - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Material Flammability Rating | Mounting Type | Number of Positions | Row Spacing - Mating [x] | Row Spacing - Mating [x] | Contact Length - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Number of Positions Loaded [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 0.1 in | 2.54 mm | Male Pin | Black | Unshrouded | 0.05 in | 1.27 mm | Square | Tin | Liquid Crystal Polymer (LCP) | Phosphor Bronze | All | 3.1 A | Push-Pull | Header | -55 °C | 125 °C | Solder | 1 | Gold | 5.21 mm | 0.205 in | 10 çin | 0.25 çm | UL94 V-0 | Surface Mount | |||||||
Samtec Inc. | 0.1 in | 2.54 mm | Male Pin | Black | Unshrouded | 0.05 in | 1.27 mm | Square | Tin | Liquid Crystal Polymer (LCP) | Phosphor Bronze | All | 3.1 A | Push-Pull | Header | -55 °C | 125 °C | Solder | 1 | Gold | 5.21 mm | 0.205 in | 30 Áin | 0.76 Ám | UL94 V-0 | Surface Mount | |||||||
Samtec Inc. | 0.1 in | 2.54 mm | Male Pin | Black | Unshrouded | 0.05 in | 1.27 mm | Square | Tin | Liquid Crystal Polymer (LCP) | Phosphor Bronze | All | 3.1 A | Push-Pull | Header | -55 °C | 125 °C | Solder | 2 | 5.21 mm | 0.205 in | UL94 V-0 | Surface Mount | 6 | 2.54 mm | 0.1 in | |||||||
Samtec Inc. | 0.1 in | 2.54 mm | Male Pin | Black | Unshrouded | 0.05 in | 1.27 mm | Square | Gold | Liquid Crystal Polymer (LCP) | Phosphor Bronze | All | 3.1 A | Push-Pull | Header | -55 °C | 125 °C | Solder | 1 | Gold | 0.43 in | 10 çin | 0.25 çm | UL94 V-0 | Surface Mount | 10.92 mm | 3 µin | 0.076 µm | |||||
Samtec Inc. | 0.1 in | 2.54 mm | Male Pin | Black | Unshrouded | 0.05 in | 1.27 mm | Square | Gold | Liquid Crystal Polymer (LCP) | Phosphor Bronze | All | 3.1 A | Push-Pull | Header | -55 °C | 125 °C | Solder | 2 | Gold | 3.18 mm | 0.125 in | 10 çin | 0.25 çm | UL94 V-0 | Surface Mount | 6 | 2.54 mm | 0.1 in | 3 µin | 0.076 µm | ||
Samtec Inc. | 0.1 in | 2.54 mm | Male Pin | Black | Unshrouded | 0.05 in | 1.27 mm | Square | Gold | Liquid Crystal Polymer (LCP) | Phosphor Bronze | All | 3.1 A | Push-Pull | Header | -55 °C | 125 °C | Solder | 2 | Gold | 7.24 mm | 0.285 in | 10 çin | 0.25 çm | UL94 V-0 | Surface Mount | 6 | 2.54 mm | 0.1 in | 3 µin | 0.076 µm | ||
Samtec Inc. | 0.1 in | 2.54 mm | Male Pin | Black | Unshrouded | 0.05 in | 1.27 mm | Square | Tin | Liquid Crystal Polymer (LCP) | Phosphor Bronze | All | 3.1 A | Push-Pull | Header | -55 °C | 125 °C | Solder | 1 | Gold | 4.83 mm | 0.19 " | 30 Áin | 0.76 Ám | UL94 V-0 | Surface Mount | |||||||
Samtec Inc. | 0.1 in | 2.54 mm | Male Pin | Black | Unshrouded | 0.05 in | 1.27 mm | Square | Gold | Liquid Crystal Polymer (LCP) | Phosphor Bronze | 3.1 A | Push-Pull | Header | -55 °C | 125 °C | Solder | 2 | Gold | 3.18 mm | 0.125 in | 10 çin | 0.25 çm | UL94 V-0 | Surface Mount | 6 | 2.54 mm | 0.1 in | 3 µin | 0.076 µm | 5 | ||
Samtec Inc. | 0.1 in | 2.54 mm | Male Pin | Black | Unshrouded | 0.05 in | 1.27 mm | Square | Tin | Liquid Crystal Polymer (LCP) | Phosphor Bronze | All | 3.1 A | Push-Pull | Header | -55 °C | 125 °C | Solder | 2 | 3.18 mm | 0.125 in | UL94 V-0 | Surface Mount | 6 | 2.54 mm | 0.1 in | |||||||
Samtec Inc. | 0.1 in | 2.54 mm | Male Pin | Black | Unshrouded | 0.05 in | 1.27 mm | Square | Gold | Liquid Crystal Polymer (LCP) | Phosphor Bronze | All | 3.1 A | Push-Pull | Header | -55 °C | 125 °C | Solder | 2 | Gold | 9.91 mm | 0.39 in | 10 çin | 0.25 çm | UL94 V-0 | Surface Mount | 6 | 2.54 mm | 0.1 in | 3 µin | 0.076 µm |