614-43 Series

Manufacturer: Mill-Max Manufacturing Corp.

Catalog

SKT CARRIER PGA

Part	Row Spacing	Type	Termination	Features	Contact Material - Mating	Grid Rows	Number of Positions or Pins (Grid)	Grid Columns	Contact Finish - Mating	Pitch - Post	Housing Material	Contact Finish Thickness - Mating	Pitch - Mating	Mounting Type	Operating Temperature (Max)	Operating Temperature (Min)	Contact Material - Post	Contact Finish Thickness - Post	Contact Finish - Post	Termination Post Length	Contact Resistance	Current Rating	Material Flammability Rating
Mill-Max Manufacturing Corp. 614-43-316-31-002000	0.3 in	0.3" (7.62mm) Row Spacing DIP	Solder	Carrier Open Frame	Beryllium Copper	2	16	8	Gold	0.1 in	PCT Polycyclohexylenedimethylene Terephthalate Polyester	30 µin	0.1 in	Through Hole	125 °C	-55 °C	Brass Alloy	200 µin	Tin	0.136 in	10 mOhm	3 A	UL94 V-0
Mill-Max Manufacturing Corp. 614-43-636-31-018000	0.6 in	0.6" (15.24mm) Row Spacing DIP	Solder	Carrier Open Frame	Beryllium Copper	2	36	18	Gold	0.1 in	PCT Polycyclohexylenedimethylene Terephthalate Polyester	30 µin	0.1 in	Through Hole	125 °C	-55 °C	Brass Alloy	30 µin	Tin	0.17 in	10 mOhm	3 A	UL94 V-0
Mill-Max Manufacturing Corp. 614-43-640-31-012000	0.6 in	0.6" (15.24mm) Row Spacing DIP	Solder	Carrier Open Frame	Beryllium Copper	2	40	20	Gold	0.1 in	PCT Polycyclohexylenedimethylene Terephthalate Polyester	30 µin	0.1 in	Through Hole	125 °C	-55 °C	Brass Alloy	200 µin	Tin	0.136 in		3 A
Mill-Max Manufacturing Corp. 614-43-652-31-007000	0.6 in	0.6" (15.24mm) Row Spacing DIP	Solder	Carrier Open Frame	Beryllium Copper	2	52	26	Gold	0.1 in	PCT Polycyclohexylenedimethylene Terephthalate Polyester	30 µin	0.1 in	Through Hole	125 °C	-55 °C	Brass Alloy	200 µin	Tin	0.146 in	10 mOhm	3 A	UL94 V-0
Mill-Max Manufacturing Corp. 614-43-314-31-012000	0.3 in	0.3" (7.62mm) Row Spacing DIP	Solder	Carrier Open Frame	Beryllium Copper	2	14	7	Gold	0.1 in	PCT Polycyclohexylenedimethylene Terephthalate Polyester	30 µin	0.1 in	Through Hole	125 °C	-55 °C	Brass Alloy	200 µin	Tin	0.136 in		3 A
Mill-Max Manufacturing Corp. 614-43-624-31-002000	0.6 in	0.6" (15.24mm) Row Spacing DIP	Solder	Carrier Open Frame	Beryllium Copper	2	24	12	Gold	0.1 in	PCT Polycyclohexylenedimethylene Terephthalate Polyester	30 µin	0.1 in	Through Hole	125 °C	-55 °C	Brass Alloy	200 µin	Tin	0.136 in	10 mOhm	3 A	UL94 V-0
Mill-Max Manufacturing Corp. 614-43-952-41-001000	0.9 in	0.9" (22.86mm) Row Spacing DIP	Solder	Carrier Open Frame	Beryllium Copper	2	52	26	Gold	0.1 in	PCT Polycyclohexylenedimethylene Terephthalate Polyester	30 µin	0.1 in	Through Hole	125 °C	-55 °C	Brass Alloy	200 µin	Tin	0.165 in	10 mOhm	3 A	UL94 V-0
Mill-Max Manufacturing Corp. 614-43-320-31-007000	0.3 in	0.3" (7.62mm) Row Spacing DIP	Solder	Carrier Open Frame	Beryllium Copper	2	20	10	Gold	0.1 in	PCT Polycyclohexylenedimethylene Terephthalate Polyester	30 µin	0.1 in	Through Hole	125 °C	-55 °C	Brass Alloy	200 µin	Tin	0.146 in	10 mOhm	3 A	UL94 V-0
Mill-Max Manufacturing Corp. 614-43-310-41-001000	0.3 in	0.3" (7.62mm) Row Spacing DIP	Solder	Carrier Open Frame	Beryllium Copper	2	10	5	Gold	0.1 in	PCT Polycyclohexylenedimethylene Terephthalate Polyester	30 µin	0.1 in	Through Hole	125 °C	-55 °C	Brass Alloy	200 µin	Tin	0.165 in	10 mOhm	3 A	UL94 V-0
Mill-Max Manufacturing Corp. 614-43-328-41-001000	0.3 in	0.3" (7.62mm) Row Spacing DIP	Solder	Carrier Open Frame	Beryllium Copper	2	28	14	Gold	0.1 in	PCT Polycyclohexylenedimethylene Terephthalate Polyester	30 µin	0.1 in	Through Hole	125 °C	-55 °C	Brass Alloy	200 µin	Tin	0.165 in	10 mOhm	3 A	UL94 V-0