SL-118 Series
Manufacturer: Samtec Inc.
CONN RCPT 18POS 0.1 GOLD PCB
| Part | Fastening Type | Pitch - Mating | Number of Positions Loaded | Operating Temperature (Max) | Operating Temperature (Min) | Insulation Color | Insulation Height | Contact Finish Thickness - Mating | Mounting Type | Number of Rows | Style | Connector Type | Contact Type | Termination | Number of Positions | Contact Finish - Post | Contact Finish - Mating | Contact Finish Thickness - Post | Insulation Material | Contact Material | Contact Shape | Contact Length - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Push-Pull | 0.1 in | All | 125 °C | -55 °C | Black | 0.05 in | 30 µin | Through Hole | 1 | Board | Receptacle | Female Socket | Solder | 18 | Gold | Gold | 10 µin | Liquid Crystal Polymer (LCP) | Beryllium Copper | Circular | |
Samtec Inc. | Push-Pull | 0.1 in | All | 125 °C | -55 °C | Black | 0.05 in | 30 µin | Through Hole | 1 | Board | Receptacle | Female Socket | Solder | 18 | Gold | Liquid Crystal Polymer (LCP) | Beryllium Copper | Circular | 0.082 in | ||
Samtec Inc. | Push-Pull | 0.1 in | All | 125 °C | -55 °C | Black | 0.132 in | 30 µin | Through Hole | 1 | Board | Receptacle | Female Socket | Solder | 18 | Gold | Gold | 10 µin | Liquid Crystal Polymer (LCP) | Beryllium Copper | Circular | 0.108 in |
Samtec Inc. | Push-Pull | 0.1 in | All | 125 °C | -55 °C | Black | 0.095 in | 30 µin | Through Hole | 1 | Board | Receptacle | Female Socket | Solder | 18 | Gold | Liquid Crystal Polymer (LCP) | Beryllium Copper | Circular | 0.095 in | ||
Samtec Inc. | Push-Pull | 0.1 in | All | 105 °C | -55 °C | Black | 0.122 in | Through Hole | 1 | Board | Receptacle | Female Socket | Solder | 18 | Tin | Tin | Liquid Crystal Polymer (LCP) | Beryllium Copper | Circular | 0.108 in | ||
Samtec Inc. | Push-Pull | 0.1 in | All | 125 °C | -55 °C | Black | 0.05 in | 30 µin | Through Hole | 1 | Board | Receptacle | Female Socket | Solder | 18 | Gold | Gold | 10 µin | Liquid Crystal Polymer (LCP) | Beryllium Copper | Circular | |
Samtec Inc. | Push-Pull | 0.1 in | All | 125 °C | -55 °C | Black | 0.05 in | 30 µin | Through Hole | 1 | Board | Receptacle | Female Socket | Solder | 18 | Gold | Liquid Crystal Polymer (LCP) | Beryllium Copper | Circular | |||
Samtec Inc. | Push-Pull | 0.1 in | All | 125 °C | -55 °C | Black | 0.095 in | 30 µin | Through Hole | 1 | Board | Receptacle | Female Socket | Solder | 18 | Gold | Gold | 10 µin | Liquid Crystal Polymer (LCP) | Beryllium Copper | Circular | 0.095 in |