CONN RCPT 18POS 0.1 GOLD PCB
| Part | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Fastening Type | Contact Material | Insulation Height | Insulation Height | Contact Shape | Contact Type | Pitch - Mating | Pitch - Mating | Number of Positions Loaded | Termination | Mounting Type | Connector Type | Number of Positions | Contact Length - Post [x] | Contact Length - Post [x] | Insulation Color | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish - Mating | Insulation Material | Number of Rows | Contact Finish - Post | Contact Length - Post | Contact Length - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Insulation Height [z] | Insulation Height [z] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 30 Áin | 0.76 Ám | Push-Pull | Beryllium Copper | 0.05 in | 1.27 mm | Circular | Female Socket | 0.1 in | 2.54 mm | All | Solder | Through Hole | Receptacle | 18 | 2.08 mm | 0.082 " | Black | -55 °C | 125 °C | Gold | Liquid Crystal Polymer (LCP) | 1 | |||||||
Samtec Inc. | Push-Pull | Beryllium Copper | 0.132 in | 3.35 mm | Circular | Female Socket | 0.1 in | 2.54 mm | All | Solder | Through Hole | Receptacle | 18 | Black | -55 °C | 105 ░C | Liquid Crystal Polymer (LCP) | 1 | Tin | 0.108 in | 2.75 mm | |||||||||
Samtec Inc. | 30 Áin | 0.76 Ám | Push-Pull | Beryllium Copper | 0.132 in | 3.35 mm | Circular | Female Socket | 0.1 in | 2.54 mm | All | Solder | Through Hole | Receptacle | 18 | Black | -55 °C | 125 °C | Gold | Liquid Crystal Polymer (LCP) | 1 | Gold | 0.108 in | 2.75 mm | 10 çin | 0.25 çm | ||||
Samtec Inc. | 30 Áin | 0.76 Ám | Push-Pull | Beryllium Copper | Circular | Female Socket | 0.1 in | 2.54 mm | All | Solder | Through Hole | Receptacle | 18 | 2.41 mm | 0.095 in | Black | -55 °C | 125 °C | Gold | Liquid Crystal Polymer (LCP) | 1 | 0.095 in | 2.41 mm | |||||||
Samtec Inc. | Push-Pull | Beryllium Copper | 0.122 in | 3.1 mm | Circular | Female Socket | 0.1 in | 2.54 mm | All | Solder | Through Hole | Receptacle | 18 | Black | -55 °C | 105 ░C | Liquid Crystal Polymer (LCP) | 1 | Tin | 0.108 in | 2.75 mm | |||||||||
Samtec Inc. | 30 Áin | 0.76 Ám | Push-Pull | Beryllium Copper | 0.05 in | 1.27 mm | Circular | Female Socket | 0.1 in | 2.54 mm | All | Solder | Through Hole | Receptacle | 18 | Black | -55 °C | 125 °C | Gold | Liquid Crystal Polymer (LCP) | 1 | Gold | 10 çin | 0.25 çm | ||||||
Samtec Inc. | 30 Áin | 0.76 Ám | Push-Pull | Beryllium Copper | 0.05 in | 1.27 mm | Circular | Female Socket | 0.1 in | 2.54 mm | All | Solder | Through Hole | Receptacle | 18 | Black | -55 °C | 125 °C | Gold | Liquid Crystal Polymer (LCP) | 1 | |||||||||
Samtec Inc. | 30 Áin | 0.76 Ám | Push-Pull | Beryllium Copper | Circular | Female Socket | 0.1 in | 2.54 mm | All | Solder | Through Hole | Receptacle | 18 | 2.41 mm | 0.095 in | Black | -55 °C | 125 °C | Gold | Liquid Crystal Polymer (LCP) | 1 | Gold | 10 çin | 0.25 çm | 0.095 in | 2.41 mm |