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TRANS IGBT CHIP N-CH 1200V 3-PIN DIE WAFER
| Part | Package / Case | Supplier Device Package | Vce(on) (Max) @ Vge, Ic | Voltage - Collector Emitter Breakdown (Max) [Max] | Mounting Type | Current - Collector Pulsed (Icm) | IGBT Type |
|---|---|---|---|---|---|---|---|
Infineon Technologies | Die | Die | 2.42 V | 1200 V | Surface Mount | 150 A | Trench Field Stop |