CC1312PSIP Series

The SimpleLink™CC1312PSIP device is an RF certified System-in-Package (SiP) Sub-1 GHz wireless module supportingWi-SUN®, Wireless M-Bus, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN),mioty, proprietary systems, including theTI 15.4-Stack. The CC1312PSIP microcontroller (MCU) is based on an Arm Cortex M4F main processor and optimized for low-power wireless communication and advanced sensing ingrid infrastructure,building automation,retail automationandmedical applications. The CC1312PSIP has a low sleep current of 0.9 µA with RTC and 80KB RAM retention. In addition to the main Cortex® M4F processor, the device also has an autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at average 1-µA system current. The CC1312PSIP hasLow SER (Soft Error Rate) FIT (Failure-in-time)for long operational lifetime. Always-on SRAM parity minimizes risk for corruption due to potential radiation events. Consistent with many customers’ 10 to 15 years or longer life cycle requirements, TI has aproduct life cycle policywith a commitment to product longevity and continuity of supply including dual sourcing of key components in the SIP. The CC1312PSIP device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Wi-SUN®, Amazon Sidewalk,mioty, Sub-1 GHz MCUs, and host MCUs. CC1312PSIP is part of a portfolio that includes pin-compatible 2.4-GHz SIPs for easy adaption of a wireless product to multiple communication standards. The commonSimpleLink Low Power F2 SDKandSysConfigsystem configuration tool supports migration between devices in the portfolio. A comprehensive number of software stacks, application examples and SimpleLink™ Academy training sessions are included in the SDK. For more information, visitwireless connectivity. The SimpleLink™CC1312PSIP device is an RF certified System-in-Package (SiP) Sub-1 GHz wireless module supportingWi-SUN®, Wireless M-Bus, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN),mioty, proprietary systems, including theTI 15.4-Stack. The CC1312PSIP microcontroller (MCU) is based on an Arm Cortex M4F main processor and optimized for low-power wireless communication and advanced sensing ingrid infrastructure,building automation,retail automationandmedical applications. The CC1312PSIP has a low sleep current of 0.9 µA with RTC and 80KB RAM retention. In addition to the main Cortex® M4F processor, the device also has an autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at average 1-µA system current. The CC1312PSIP hasLow SER (Soft Error Rate) FIT (Failure-in-time)for long operational lifetime. Always-on SRAM parity minimizes risk for corruption due to potential radiation events. Consistent with many customers’ 10 to 15 years or longer life cycle requirements, TI has aproduct life cycle policywith a commitment to product longevity and continuity of supply including dual sourcing of key components in the SIP. The CC1312PSIP device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Wi-SUN®, Amazon Sidewalk,mioty, Sub-1 GHz MCUs, and host MCUs. CC1312PSIP is part of a portfolio that includes pin-compatible 2.4-GHz SIPs for easy adaption of a wireless product to multiple communication standards. The commonSimpleLink Low Power F2 SDKandSysConfigsystem configuration tool supports migration between devices in the portfolio. A comprehensive number of software stacks, application examples and SimpleLink™ Academy training sessions are included in the SDK. For more information, visitwireless connectivity.