CONN HEADER SMD 66POS 1.27MM
| Part | Current Rating (Amps) | Contact Finish - Post | Pitch - Mating | Pitch - Mating | Termination | Contact Length - Mating | Contact Length - Mating | Mounting Type | Shrouding | Contact Shape | Contact Finish - Mating | Insulation Color | Connector Type | Operating Temperature [Min] | Operating Temperature [Max] | Number of Rows | Contact Type | Number of Positions Loaded | Insulation Material | Fastening Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material | Insulation Height | Insulation Height | Material Flammability Rating | Row Spacing - Mating [x] | Row Spacing - Mating [x] | Number of Positions | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Features | Contact Length - Mating [x] | Contact Length - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 3.1 A | Gold | 0.05 in | 1.27 mm | Solder | 0.285 in | 7.24 mm | Surface Mount | Unshrouded | Square | Gold | Black | Header | -55 °C | 125 °C | 2 | Male Pin | All | Liquid Crystal Polymer (LCP) | Push-Pull | 3 µin | 0.076 µm | Phosphor Bronze | 0.1 in | 2.54 mm | UL94 V-0 | 2.54 mm | 0.1 in | 66 | 10 çin | 0.25 çm | |||
Samtec Inc. | 3.1 A | Gold | 0.05 in | 1.27 mm | Solder | 5.84 mm | Surface Mount | Unshrouded | Square | Gold | Black | Header | -55 °C | 125 °C | 2 | Male Pin | All | Liquid Crystal Polymer (LCP) | Push-Pull | 3 µin | 0.076 µm | Phosphor Bronze | 0.1 in | 2.54 mm | UL94 V-0 | 2.54 mm | 0.1 in | 66 | 10 çin | 0.25 çm | Board Guide | 0.23 in | ||
Samtec Inc. | 3.1 A | Gold | 0.05 in | 1.27 mm | Solder | 0.285 in | 7.24 mm | Surface Mount | Unshrouded | Square | Gold | Black | Header | -55 °C | 125 °C | 2 | Male Pin | All | Liquid Crystal Polymer (LCP) | Push-Pull | 3 µin | 0.076 µm | Phosphor Bronze | 0.1 in | 2.54 mm | UL94 V-0 | 2.54 mm | 0.1 in | 66 | 10 çin | 0.25 çm | Pick and Place | ||
Samtec Inc. | 3.1 A | Gold | 0.05 in | 1.27 mm | Solder | 0.43 in | Surface Mount | Unshrouded | Square | Gold | Black | Header | -55 °C | 125 °C | 2 | Male Pin | All | Liquid Crystal Polymer (LCP) | Push-Pull | 3 µin | 0.076 µm | Phosphor Bronze | 0.1 in | 2.54 mm | UL94 V-0 | 2.54 mm | 0.1 in | 66 | 10 çin | 0.25 çm | 10.92 mm | |||
Samtec Inc. | 3.1 A | Gold | 0.05 in | 1.27 mm | Solder | 0.285 in | 7.24 mm | Surface Mount | Unshrouded | Square | Gold | Black | Header | -55 °C | 125 °C | 2 | Male Pin | All | Liquid Crystal Polymer (LCP) | Push-Pull | 3 µin | 0.076 µm | Phosphor Bronze | 0.1 in | 2.54 mm | UL94 V-0 | 2.54 mm | 0.1 in | 66 | 10 çin | 0.25 çm | Pick and Place | ||
Samtec Inc. | 3.1 A | Gold | 0.05 in | 1.27 mm | Solder | 0.125 in | 3.18 mm | Surface Mount | Unshrouded | Square | Gold | Black | Header | -55 °C | 125 °C | 2 | Male Pin | All | Liquid Crystal Polymer (LCP) | Push-Pull | 3 µin | 0.076 µm | Phosphor Bronze | 0.1 in | 2.54 mm | UL94 V-0 | 2.54 mm | 0.1 in | 66 | 10 çin | 0.25 çm | Pick and Place | ||
Samtec Inc. | 3.1 A | Gold | 0.05 in | 1.27 mm | Solder | 0.19 " | 4.83 mm | Surface Mount | Unshrouded | Square | Gold | Black | Header | -55 °C | 125 °C | 1 | Male Pin | All | Liquid Crystal Polymer (LCP) | Push-Pull | 3 µin | 0.076 µm | Phosphor Bronze | 0.1 in | 2.54 mm | UL94 V-0 | 33 | 10 çin | 0.25 çm | |||||
Samtec Inc. | 3.1 A | Tin | 0.05 in | 1.27 mm | Solder | 5.84 mm | Surface Mount | Unshrouded | Square | Gold | Black | Header | -55 °C | 125 °C | 2 | Male Pin | All | Liquid Crystal Polymer (LCP) | Push-Pull | Phosphor Bronze | 0.1 in | 2.54 mm | UL94 V-0 | 2.54 mm | 0.1 in | 66 | 10 çin | 0.25 çm | 0.23 in |