Catalog(3 parts)
| Part | Voltage - Supply▲▼ | Voltage - Supply▲▼ | Current - Output High, Low▲▼ | Current - Output High, Low▲▼ | Mounting Type | Output Type | Logic Type | Package / Case | Supplier Device Package | Operating Temperature▲▼ | Operating Temperature▲▼ | Number of Bits per Element▲▼ | Number of Elements▲▼ | Package / Case▲▼ | Package / Case▲▼ |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments SN74AHC16541DLBuffer, Non-Inverting 2 Element 8 Bit per Element 3-State Output 48-SSOP | 2 V | 5.5 V | 0.00800000037997961 A | 0.00800000037997961 A | Surface Mount | 3-State | Buffer, Non-Inverting | 48-BSSOP (0.295", 7.50mm Width) | 48-SSOP | 85 °C | -40 °C | 8 ul | 2 ul | ||
Texas Instruments SN74AHC16541DGVRBuffer, Non-Inverting 2 Element 8 Bit per Element 3-State Output 48-TVSOP | 2 V | 5.5 V | 0.00800000037997961 A | 0.00800000037997961 A | Surface Mount | 3-State | Buffer, Non-Inverting | 48-TFSOP | 85 °C | -40 °C | 8 ul | 2 ul | |||
Texas Instruments SN74AHC16541DGGRBuffer, Non-Inverting 2 Element 8 Bit per Element 3-State Output 48-TSSOP | 2 V | 5.5 V | 0.00800000037997961 A | 0.00800000037997961 A | Surface Mount | 3-State | Buffer, Non-Inverting | 48-TFSOP | 48-TSSOP | 85 °C | -40 °C | 8 ul | 2 ul | 0.006099999882280827 m | 0.006095999851822853 m |
Key Features
• Members of the Texas InstrumentsWidebusTMFamilyEPICTM(Enhanced-Performance Implanted CMOS) ProcessOperating Range 2-V to 5.5-V VCCDistributed VCCand GND Pins Minimize High-Speed Switching NoiseFlow-Through Architecture Optimizes PCB LayoutLatch-Up Performance Exceeds 250 mA Per JESD 17Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), and Thin Very Small-Outline (DGV) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center SpacingsEPIC and Widebus are trademarks of Texas Instruments Incorporated.Members of the Texas InstrumentsWidebusTMFamilyEPICTM(Enhanced-Performance Implanted CMOS) ProcessOperating Range 2-V to 5.5-V VCCDistributed VCCand GND Pins Minimize High-Speed Switching NoiseFlow-Through Architecture Optimizes PCB LayoutLatch-Up Performance Exceeds 250 mA Per JESD 17Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), and Thin Very Small-Outline (DGV) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center SpacingsEPIC and Widebus are trademarks of Texas Instruments Incorporated.
Description
AI
The 'AHC16541 devices are noninverting 16-bit buffers composed of two 8-bit sections with separate output-enable signals. For either 8-bit buffer section, the two output-enable (1OE1\ and 1OE2\ or 2OE1\ and 2OE2\) inputs must be low for the corresponding Y outputs to be active. If either output-enable input is high, the outputs of that 8-bit buffer section are in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE\ should be tied to VCCthrough a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
The SN54AHC16541 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74AHC16541 is characterized for operation from -40°C to 85°C.
The 'AHC16541 devices are noninverting 16-bit buffers composed of two 8-bit sections with separate output-enable signals. For either 8-bit buffer section, the two output-enable (1OE1\ and 1OE2\ or 2OE1\ and 2OE2\) inputs must be low for the corresponding Y outputs to be active. If either output-enable input is high, the outputs of that 8-bit buffer section are in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE\ should be tied to VCCthrough a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
The SN54AHC16541 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74AHC16541 is characterized for operation from -40°C to 85°C.