HTEC8-160 Series
Standard Card Edge Connectors 0.80 mm 30P Rugged High-Speed Edge Card
Manufacturer: Samtec Inc.
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Standard Card Edge Connectors 0.80 mm 30P Rugged High-Speed Edge Card
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Standard Card Edge Connectors 0.80 mm 30P Rugged High-Speed Edge Card
Standard Card Edge Connectors 0.80 mm 30P Rugged High-Speed Edge Card
Standard Card Edge Connectors 0.80 mm 30P Rugged High-Speed Edge Card
| Part | Read Out | Contact Finish | Pitch [x] | Pitch [x] | Contact Finish Thickness | Contact Finish Thickness | Card Thickness | Card Thickness | Number of Positions/Bay/Row [custom] | Number of Rows | Color | Gender | Card Type | Features | Termination | Number of Positions | Contact Material | Operating Temperature [Min] | Operating Temperature [Max] | Contact Type | Mounting Type | Material - Insulation | Termination Rows | Number of Positions/Bay/Row [custom] | Number of Positions/Bay/Row [custom] | Number of Positions/Bay/Row [custom] | Number of Positions/Bay/Row [custom] | Number of Positions/Bay/Row [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Dual | Gold | 0.8 mm | 0.031 in | 0.76 Ám | 30 Áin | 0.062 in | 1.57 mm | 30 | 2 | Black | Female | Non Specified - Dual Edge | Board Guide Pick and Place Solder Retention | Solder | 60 | Copper Alloy | -55 °C | 125 °C | Cantilever | Surface Mount | Liquid Crystal Polymer (LCP) | ||||||
Samtec Inc. | Dual | Gold | 0.8 mm | 0.031 in | 0.25 Ám | 10 Áin | 0.062 in | 1.57 mm | 40 | 2 | Black | Female | PCI Express™ | Board Guide Pick and Place | Solder | 80 | Copper Alloy | -55 °C | 125 °C | Cantilever | Surface Mount | Liquid Crystal Polymer (LCP) | 2 | |||||
Samtec Inc. | Dual | Gold | 0.8 mm | 0.031 in | 0.76 Ám | 30 Áin | 0.062 in | 1.57 mm | 40 | 2 | Black | Female | PCI Express™ | Board Guide Pick and Place | Solder | 80 | Copper Alloy | -55 °C | 125 °C | Cantilever | Surface Mount | Liquid Crystal Polymer (LCP) | 2 | |||||
Samtec Inc. | Dual | Gold | 0.8 mm | 0.031 in | 0.76 Ám | 30 Áin | 0.062 in | 1.57 mm | 50 | 2 | Black | Female | PCI Express™ | Board Guide Pick and Place | Solder | 100 | Copper Alloy | -55 °C | 125 °C | Cantilever | Surface Mount | Liquid Crystal Polymer (LCP) | 2 | |||||
Samtec Inc. | Dual | Gold | 0.8 mm | 0.031 in | 0.25 Ám | 10 Áin | 0.062 in | 1.57 mm | 2 | Black | Female | PCI Express™ | Board Guide Pick and Place | Solder | 100 | Copper Alloy | -55 °C | 125 °C | Cantilever | Surface Mount | Liquid Crystal Polymer (LCP) | 2 | 23 | 27 | ||||
Samtec Inc. | Dual | Gold | 0.8 mm | 0.031 in | 0.76 Ám | 30 Áin | 0.062 in | 1.57 mm | 2 | Black | Female | PCI Express™ | Board Guide Pick and Place | Solder | 40 | Copper Alloy | -55 °C | 125 °C | Cantilever | Surface Mount | Liquid Crystal Polymer (LCP) | 2 | 20 | 20 | 20 | |||
Samtec Inc. | Dual | Gold | 0.8 mm | 0.031 in | 0.76 Ám | 30 Áin | 0.062 in | 1.57 mm | 2 | Black | Female | PCI Express™ | Board Guide Pick and Place | Solder | 160 | Copper Alloy | -55 °C | 125 °C | Cantilever | Surface Mount | Liquid Crystal Polymer (LCP) | 2 | 80 |